Our 2030+ Sustainability Ambition Framework sets the frame for our global sustainability strategy, with clear ambitions and targets that we want to achieve in this decade.

Bergquist 的 SIL PAD TSP 3500 是一款矽氧彈性體，經過精心配製，可將介電和散熱效能最大化。

Bergquist 的 GAP FILLER TGF 3600 是一款雙組件型液態間隙填充材料，具有超高的散熱效能。

The Bergquist Company 是全球領先的熱管理材料開發商與製造商，產品包括 Sil-Pad® 導熱絕緣體及多種專用材料；Gap Pad® 填隙材料、Hi-Flow® 相變材料、Softface® 及 Bond-Ply®。

Thermal management of power electronics, whether power supplies or power components, requires interfacing the package to a heat sink using a thermal interface material (TIM).

Advanced communication technologies, motor controls, drives and power converters are delivering more function in smaller form factors, which raises power densities and increases heat generation.

Bergquist 的 GapPad® TGP 6000ULM 是基於有機矽的非導電型間隙墊片，具有高度的適應性，可以涵蓋各種形狀。

Bergquist 的 Gap Pad TGP 7000ULM 是軟的間隙填充用材料，額定為 7.0 W/m-K，是為要求低組裝應力的高性能應用而配製的。

LOCTITE STYCAST 2850FT 導熱環氧樹脂密封劑，設計用於需要散熱和熱衝擊特性元件的密封。

GAP PAD®, SIL PAD®, & HI-FLOW Ordering Information

As you are aware, Henkel acquired The Bergquist Company in late 2014. Since then, Henkel has been integrating the Bergquist organization and analyzing the parallel IT systems in an effort to create minimal disruption once the IT systems are brought together

Bergquist 的 HC 5.0 間隙墊片是柔軟且服貼的間隙填補材質，熱傳導率為 5.0 W/m-K，提供優異的熱效能，並具有極低的壓縮應力。

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Sil-Pad® 900S 絕緣材料，熱阻抗值為 0.61°C-in2/W（50 psi 時），適合電源供應器等應用。

Q-Pad® 3 是能取代玻璃強化散熱脂的散熱介面，可在焊接與清潔之前安裝。

Gap Pad® 1500 非增強型填隙材料具有 1.5 W/m-k 導熱性、服貼度與低硬度的特性。

Sil-Pad® K-10 Kapton 結構絕緣體提供良好的切割特性以及優異的散熱效能。