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Bergquist

- Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).

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Liquid Gap Fillers

Image of Bergquists Liquid Gap Fillers

Henkel / Bergquist’s GAP FILLER materials are two-component, thermally conductive, form-in-place elastomers that provide virtually zero stress on components. Learn More

Thermal Gap Pads

Image of Henkel/Bergquist's Thermal Gap Pads

Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability. Learn More

Thermal Sil-Pads

Image of Bergquists Thermal Sil-Pads

Henkel / Bergquist’s line of SIL-PAD materials offer excellent thermal performance, are more durable than mica, create less mess than grease and are highly cost efficient. Learn More

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Newest Products 查看全部 (8)

Gap Pad® TGP 6000ULM

Bergquist 的 GapPad® TGP 6000ULM 是基於有機矽的非導電型間隙墊片,具有高度的適應性,可以涵蓋各種形狀。 瞭解詳情

Gap Pad® TGP 7000ULM

Bergquist 的 Gap Pad TGP 7000ULM 是軟的間隙填充用材料,額定為 7.0 W/m-K,是為要求低組裝應力的高性能應用而配製的。 瞭解詳情

HC 5.0 間隙墊片

Bergquist 的 HC 5.0 間隙墊片是柔軟且服貼的間隙填補材質,熱傳導率為 5.0 W/m-K,提供優異的熱效能,並具有極低的壓縮應力。 瞭解詳情

Sil-Pad® 900S

Sil-Pad® 900S 絕緣材料,熱阻抗值為 0.61°C-in2/W(50 psi 時),適合電源供應器等應用。 瞭解詳情

Q-Pad® 3

Q-Pad® 3 是能取代玻璃強化散熱脂的散熱介面,可在焊接與清潔之前安裝。 瞭解詳情

Gap Pad® 1500

Gap Pad® 1500 非增強型填隙材料具有 1.5 W/m-k 導熱性、服貼度與低硬度的特性。 瞭解詳情

Recent PTMs 查看全部 (5)

Gap Pad EMI 1 發佈日期:2015-11-16

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Duration: 15 minutes
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft 發佈日期:2014-02-18

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Duration: 5 minutes
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics 發佈日期:2013-11-04

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Duration: 15 minutes
Thermal Interface Materials (TIM) Gap Pad 發佈日期:2013-07-24

An electrically isolating material which provides protection between heat sinks and high voltage devices.

Duration: 5 minutes

Featured Videos 查看全部 (1)

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.

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