ESD Protection USB Interface

Comchip's ESD protection USB interface application guide.

Automotive Applications Guide

Comchip's 2022 automotive applications guide.

評估穿戴式應用的各種開發板與原型開發板 發佈日期:2020-08-12

對於成本與尺寸受限的設計,業餘愛好者、學生和專業工程師可以轉向使用以 Arduino 為基礎的開發板。

如何為邏輯電路或閘極設計選擇 MOSFET

與其他傳統電晶體技術相比,使用 MOSFET 進行邏輯和小型訊號切換的優勢。

Comchip Diodes in WLCSP (Wafer Level Chip Scale Package)

The WLCSP is a brand new package technique for discrete semiconductor parts and space limited application demands.

PCN - Traceability Labels

Traceability of product dedicated equipment production.

Image of Comchip's SiC Schottky Barrier Diodes SiC 肖特基能障二極體 發佈日期:2019-08-12

Comchip 的碳化矽 (SiC) 系列二極體在高溫條件下表現良好,並具有超低的逆電流 (IR),可提高效率。

SOD-123F General Purpose Rectifier (AEC-Q101)

Comchip's SOD-123F General Purpose Rectifier (AEC-Q101)

Cross Reference

Comchip Cross Reference

Comchip Technology Names Digi-Key 2015 Distributor Partner of the Year 發佈日期:2016-05-16

Global electronic components distributor Digi-Key Electronics was awarded Comchip Technology’s 2015 Distributor Partner of the Year during EDS 2016 in Las Vegas, NV.

Flat Chip Manufacturing Process

Demonstrating Comchip's unique flat chip manufacturing process.Comchip's diodes are a direct drop-in replacement for lead-framed packages, so no rework of the PCB is needed and valuable time is conserved.

USB 3.1/USB Type-C 發佈日期:2016-02-18

Learn the capabilities and suitable applications for USB 3.1 and Type-C which are both relatively new to the USB family.

General Lighting

Comchip has many products for lighting application – from traditional ballast lighting to energy efficient LED lighting.

Comchip Technology's Flat Chip Diode Manufacturing Process 2015

Image of Comchips ACURN Series ACURN 系列整流器 發佈日期:2015-02-04

Comchip 推出 ACURN 系列整流器

Image of Compchips ACDBCT3 Series ACDBCT3 系列肖特基二極體 發佈日期:2015-02-04

Comchip 的 ACDBCT3 系列肖特基二極體具有 3.0 A 順向電流

Power-Over-Ethernet Schottky Bridge Rectifiers TVS

Power-Over-Ethernet (POE) application has gained tremendous popularity and cceptance since IEEE ratified the 802.3AF standard on 6/12/03.

Image of Comchips CDBZ5T30100 Schottky Barrier CDBZ5T30100 肖特基能障整流器 發佈日期:2013-11-05

CDBZ5T30100-HF 具有低功耗和高效率的特點,峰值順向突波電流為 350 A。

Image of Comchips CDBZ31060-HF Schottky Barrier CDBZ31060-HF 肖特基能障整流器 發佈日期:2013-10-28

CDBZ31060-HF 採用表面黏著式 TO-277/Z3 封裝,無引線且厚度薄,非常適合高速表面黏著製程。

Image of Compchips Z4GP2 Series Z4GP2 系列薄型扁平晶片橋式整流器 發佈日期:2013-10-28

Z4GP2 系列橋式整流器二極體具有 2.0 A 順向電流以及 600 V、800 V 或 1000 V 的逆向電壓。