Comchip's ESD protection USB interface application guide.
與其他傳統電晶體技術相比,使用 MOSFET 進行邏輯和小型訊號切換的優勢。
The WLCSP is a brand new package technique for discrete semiconductor parts and space limited application demands.
Traceability of product dedicated equipment production.
Comchip's SOD-123F General Purpose Rectifier (AEC-Q101)
Global electronic components distributor Digi-Key Electronics was awarded Comchip Technology’s 2015 Distributor Partner of the Year during EDS 2016 in Las Vegas, NV.
Demonstrating Comchip's unique flat chip manufacturing process.Comchip's diodes are a direct drop-in replacement for lead-framed packages, so no rework of the PCB is needed and valuable time is conserved.
Learn the capabilities and suitable applications for USB 3.1 and Type-C which are both relatively new to the USB family.
Comchip has many products for lighting application – from traditional ballast lighting to energy efficient LED lighting.
Comchip Technology's Flat Chip Diode Manufacturing Process 2015
Power-Over-Ethernet (POE) application has gained tremendous popularity and cceptance since IEEE ratified the 802.3AF standard on 6/12/03.