The lower thermal resistance of modern multi-layer PCBs to ambient Rth(sp-a) of multi-layer PCBs is perfectly paired with Nexperia‘s DFN2020D-3 package technology to reduce the size of the total design while increasing thermal performance. Compared to the thermal performance of conventional medium power SMD plastic packages (like SOT89 or SOT223) on single layer PCB, DFN2020D-3 on it‘s standard footprint and mounted on a 4-layer PCB has higher total power dissipation (Ptot) capabilities and therefore increases the packing and current density of the total design. The table with the Ptot simulation results is shown here to help designers estimate the Ptot performance between different PCBs, and choose the best device based on the main requirements regarding occupied PCB area and required Ptot.