Nexperia’s DFN (Discrete Flat NoLeads) packages technology was developed in the 2000s. It offers high packing and current density on multi-layer PCB, reducing design size and costs. DFN package technology is an SMD package platform with optimized heatsink, mountig pad and thermal resistance design, by using big collector mounting pad directly under the transistor die to remove the heat from the BJT to the PCB. A thin leadframe to reduce the thermal resistance from the transistor junction to the solder point (Rth(j-sp)). Finally, no leads and space optimized plastic package with only 2.3 mm x 2.1 mm occupied board space on standard footprint. The DFN2020 is well suited as a replacement for the standard medium power transistor series in the conventional SOT89 and SOT223 SMD plastic packages (like BCX55 or BCP55). The D-version DFN2020D-3 has solderable, tin plated side leads, enabling automatic optical inspection (AOI) of the solder quality, targeted at Automotive and Industrial applications. The DFN2020 is an approved and future proof solution available from mulitple supplies of medium power transistors.