For the families of medium-power transistors, SOT223 and SOT89 are common SMD packages in consumer electronics, widely used since the late 80’s to replace through hole or larger SMD packages like DPAK with the value of space conservation. Since then, advances in silicon technology lead to a significant reduction of the transistor dies, enabling much smaller packages, to increase the packing density on PCB. For example DFN2020D-3, with an occupied PCB mounting area of only 2.3 x 2.1 mm, occupies only 1/12th of the SOT223 required PCB space, while improving the thermal performance when mounted on modern multi-layer PCBs.