Winbond OctalNAND Flash
Winbond OctalNAND Flash

Fast boot loaders for autonomous driving systems and instrument panel displays, AI training model, database storage systems, and over-the-air programming updates for gaming all have one thing in common - an ever-growing need for more Flash memory.

Winbond Focused Product Solutions at Electronica 2024

Winbond showcases the latest memory technologies and applications at electronica 2024.

Winbond AI Solutions
Winbond AI Solutions

Winbond’s advanced DRAM and Flash memory solutions, which are crucial for AIoT and embedded AI applications. Additionally, the TrustME® Secure Flash is presented, ensuring robust security for AI systems.

Winbond Memory for Automotive Solution
Winbond Memory for Automotive Solution

Winbond brings you high quality and high performance for these automotive-grade memory solutions, including Mobile DRAM, Specialty DRAM, Code Storage Flash and TrustME Secure Flash.

DRAM Memories Products

Specialty DRAM & Mobile DRAM.

不採用雲端連接，快速實作防偽冒人臉辨識 發佈日期：2021-02-24

專用處理器和軟體函式庫提供更簡單、更安全的人臉辨識式驗證替代方案。

增添連續 Wi-Fi 連線能力而不犧牲電池續航力 發佈日期：2020-09-24

設計人員可以使用無線 SoC 的專業電源管理技術，以最小電流量支援連續 Wi-Fi 連線。

Image of Winbond's W25Q512JV 512 Mb Serial Flash Memory W25Q512JV 512 Mb 串列式快閃記憶體 發佈日期：2019-12-03

Winbond 的 W25Q512JV (512 Mb) 串列式快閃記憶體可為空間、引腳和功率有限的系統提供儲存解決方案。

Winbond Electronics Serial Flash Memory Part 1: SPI Interface Serial Flash Memory Part 1: SPI Interface 發佈日期：2019-10-28

This presentation will review the operation, performance and use cases for serial flash interfaces while concentrating on Serial Peripheral Interface or SPI.

Duration: 5 minutes
使用低成本模組和 MicroPython，快速打造以 AI 為基礎的視覺與聽覺裝置 發佈日期：2019-08-01

開發人員可以使用 MicroPython 和神經網路處理模組，快速實作以機器學習為基礎的語音和物件辨識設計。

SDRAM-SM SDRAM Memory Basic Introduction 發佈日期：2018-07-23

This presentation will highlight Winbond’s SDRAM Memory Basic Introduction.

Duration: 10 minutes
Design Robust Systems for the Industrial IoT 發佈日期：2018-01-25

The Industrial IoT requires designers to pay particular attention to architecture, device reliability and robustness, and connectivity.

Image of Winbond's W25N QspiNAND Flash W25N QspiNAND 快閃記憶體 發佈日期：2017-01-25

Winbond 的 SLC NAND 快閃記憶體產品可直接替代業界不同供應商的 ONFi SLC NAND 產品，且彼此相容。

Image of Winbond's Specialty DRAM and Mobile DRAM Products 專用型 DRAM 和行動 DRAM 產品 更新日期： 2020-05-22

Winbond 是世界主要的 DARM 供應商之一，專門以嵌入式設計和行動市場為目標。

W25 spiFlash Series - Winbond W25 SpiFlash® 系列 發佈日期：2017-01-25

Winbond 的 W25X 與 W25Q SpiFlash® 多重 I/O 記憶體具有常用序列周邊裝置介面 (SPI)，512 Kbit 至 512 Mbit 的密度、小型抹除領域，以及業界最高效能。

Managing Multi-Standard Connectivity Requirements in IoT Designs 發佈日期：2016-05-04

IoT apps demand connectivity straddling both industrial and consumer communications requirements. Multi-standard wireless MCUs now offer more these options.

Serial Look Up Tables for Sensors Save Space and Improve Accuracy 發佈日期：2013-07-18

Analog transducers and sensors do a good job of translating a real world physical condition into an electronic signal that we can measure and use.

Winbond America Expands Digi-Key Distribution Agreement to Include Europe 發佈日期：2006-10-03

Digi-Key Corporation and Winbond Electronics Corporation America announce the expansion of the companies' current distribution agreement to include Europe.

Image of Winbond Electronics color logo Winbond Electronics Corporation

Winbond Electronics Corporation America (WECA) 在 1990 年成立，負責 Winbond Electronics Corporation 的業務、行銷與設計工作，總部位於臺灣的新竹科學園區。