In past years, the thermal management in televisions and display devices has evolved to cater to steadily increasing power densities in thinner product enclosures. In the lighting and computer industry, solutions to comparable thermal challenges are based on the use of large-finned heat sinks. This is not feasible in the thin form factor of a modern TV set, because the only surface areas available for cooling are located on the front and the back of the TV. Therefore, the role of in-plane heat spreaders has become a topic of considerable interest to designers and engineers.