The diagram on the left shows the pin assignment in the R8C/3x Series. The colored circles depict the location of ports and system pins. Besides having the same CPU core and same peripherals, these devices have been carefully designed to provide 100% package scalability. As shown in the diagram on the right, the R8C comes in packages as small as 4mm x 4mm to 16mm x 16mm. By providing such scalability and compatibility, designers can easily tackle two great challenges: migration up or down in case the application’s requirements change, and providing designs for multiple versions of the product by incorporating multiple package footprints. Renesas’ ultimate goal is to enable designers to reduce time-to-market and total development cost.