Heat Sinks

Results: 114,604
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Showing
of 114,604
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
507302B00000G
507302B00000G
HEATSINK TO-220 2.5W LOW PROFILE
Boyd Laconia, LLC
29,839
In Stock
1 : $2.72000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Square, Fins
0.750" (19.05mm)
0.750" (19.05mm)
-
0.380" (9.65mm)
2.5W @ 60°C
10.00°C/W @ 200 LFM
24.00°C/W
Aluminum
Black Anodized
274-1AB 345-1023
274-1AB
HEATSINK TO-220 LOW HEIGHT BLK
Wakefield-Vette
5,008
In Stock
1 : $2.88000
Bulk
Bulk
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
2.0W @ 56°C
8.00°C/W @ 400 LFM
28.00°C/W
Aluminum
Black Anodized
V7236B1
V7236B1
HEATSINK TO-220 19.05X13.21MM
Assmann WSW Components
21,636
In Stock
1 : $2.96000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
-
-
24.00°C/W
Aluminum
Black Anodized
V8508A
V8508A
HEATSINK TO-220 19X12.80MM
Assmann WSW Components
15,321
In Stock
1 : $3.54000
Bulk
-
Bulk
Active
Board Level
TO-220
Press Fit
Rectangular, Fins
0.748" (19.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
3.0W @ 60°C
14.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
574502B00000G
574502B00000G
HEATSINK TO-220 VERT MNT .75"
Boyd Laconia, LLC
24,814
In Stock
1 : $3.70000
Bag
-
Bag
Active
Board Level
TO-220
Clip
Rectangular, Fins
0.750" (19.05mm)
0.860" (21.84mm)
-
0.395" (10.03mm)
3.0W @ 60°C
8.00°C/W @ 400 LFM
21.20°C/W
Aluminum
Black Anodized
15,660
In Stock
1 : $3.95000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
290-1AB
290-1AB
HEATSINK TO-220 VERT/HORZ BLK
Wakefield-Vette
21,404
In Stock
1 : $4.28000
Bulk
Bulk
Active
Board Level
TO-218, TO-202, TO-220
Bolt On
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
2.0W @ 44°C
7.00°C/W @ 400 LFM
22.00°C/W
Aluminum
Black Anodized
V-1100-SMD/B-L
V-1100-SMD/B-L
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
20,747
In Stock
1 : $4.69000
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
V-1100-SMD/A-L
V-1100-SMD/A-L
HEATSINK TO-263 12.70X26.20MM
Assmann WSW Components
6,937
In Stock
1 : $4.77000
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.390" (9.91mm)
-
-
23.00°C/W
Copper
Tin
V2017B
V2017B
HEATSINK ANOD ALUM CPU
Assmann WSW Components
35,590
In Stock
1 : $5.43000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
-
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
-
-
31.00°C/W
Aluminum
Black Anodized
5,313
In Stock
1 : $5.68000
Tray
-
Tray
Active
Board Level
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.181" (30.00mm)
-
0.472" (12.00mm)
-
-
10.00°C/W
Aluminum
Black Anodized
577002B00000G
577002B00000G
HEAT SINK TO-220 .250" COMPACT
Boyd Laconia, LLC
3,150
In Stock
1 : $6.17000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.250" (6.35mm)
1.5W @ 50°C
10.00°C/W @ 500 LFM
32.00°C/W
Aluminum
Black Anodized
V-1100-SMD/B
V-1100-SMD/B
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
98,203
In Stock
1 : $6.42000
Cut Tape (CT)
400 : $4.66363
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
576802B04000G
576802B04000G
HEAT SINK VERT PLUG-IN TO-220
Boyd Laconia, LLC
14,257
In Stock
1 : $7.74000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220, TO-262
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.500" (12.70mm)
-
0.500" (12.70mm)
1.0W @ 30°C
7.00°C/W @ 400 LFM
27.30°C/W
Aluminum
Black Anodized
576802B03900G
576802B03900G
HEATSINK TO220 CLIPON W/TAB.75"
Boyd Laconia, LLC
10,472
In Stock
1 : $7.82000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220, TO-262
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.500" (12.70mm)
-
0.500" (12.70mm)
1.0W @ 30°C
7.00°C/W @ 400 LFM
27.30°C/W
Aluminum
Black Anodized
110991327
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
15,074
In Stock
1 : $8.15000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
577102B00000G
577102B00000G
HEAT SINK TO-220 .375" COMPACT
Boyd Laconia, LLC
7,868
In Stock
1 : $8.23000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
3.0W @ 80°C
12.00°C/W @ 200 LFM
25.90°C/W
Aluminum
Black Anodized
HSS15-B20-P40
HSS15-B20-P40
HEAT SINK, STAMPING, TO-220, 23.
Same Sky (Formerly CUI Devices)
1,716
In Stock
1 : $8.56000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular
1.500" (38.10mm)
0.921" (23.40mm)
-
0.500" (12.70mm)
5.0W @ 75°C
8.50°C/W @ 200 LFM
15.16°C/W
Aluminum Alloy
Black Anodized
577202B00000G
577202B00000G
HEAT SINK TO-220 .500" COMPACT
Boyd Laconia, LLC
22,115
In Stock
1 : $8.64000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
1.5W @ 40°C
10.00°C/W @ 200 LFM
24.40°C/W
Aluminum
Black Anodized
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
Same Sky (Formerly CUI Devices)
1,572
In Stock
1 : $9.47000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
573100D00010G
573100D00010G
HEATSINK SMT D-PAK/TO-252 TIN
Boyd Laconia, LLC
16,789
In Stock
1 : $11.28000
Cut Tape (CT)
250 : $8.44440
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
26.00°C/W
Aluminum
Tin
XL25W-12-12-12
XL25W-12-12-10
CERAMIC HEAT SINK 12X12X10MM WHI
t-Global Technology
2,538
In Stock
1 : $11.28000
Bulk
Bulk
Active
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape
Square
0.472" (12.00mm)
0.472" (12.00mm)
-
0.394" (10.00mm)
-
-
-
Ceramic
-
574502B03300G
574502B03300G
HEATSINK TO-220 VERT MNT W/TAB
Boyd Laconia, LLC
1,054
In Stock
1 : $11.28000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.810" (20.57mm)
-
0.390" (9.91mm)
3.0W @ 60°C
6.00°C/W @ 600 LFM
21.20°C/W
Aluminum
Black Anodized
LTN20069-T5
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield-Vette
6,100
In Stock
1 : $11.85000
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
3083
3083
ALUM HEAT SINK FOR RASPBERRY PI
Adafruit Industries LLC
2,574
In Stock
1 : $12.35000
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi 3
Thermal Tape, Adhesive (Included)
Square, Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.315" (8.00mm)
-
-
-
Aluminum
-
Showing
of 114,604

Heat Sinks


Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.