This module will first review the market challenges often associated with mounting large traditional case size MLCCs. As a result of a sudden and abrupt change in ambient temperature, solder can crack and cause MLCC solder joint reliability issues. Furthermore, under conditions of board bending stress, the ceramic elements of MLCCs can also crack. Lastly, during high ripple current conditions, acoustic noise can occur from ceramic vibration of the MLCC. Murata’s KCM and KRM series metal terminal chip MLCCs are specifically designed to address these issues and have long-term resilience to such conditions.