Gap Pad® products are designed to improve an electronic assembly’s thermal performance and reliability with ease of use and low cost. Some of the benefits for thermal transfer using Gap Pad include reducing air gaps that impact thermal resistance especially between two uneven surfaces. It also conforms to these uneven surfaces for reducing interfacial resistance. Gap Pad is designed to have electrical isolation to reduce current leakage, plus resistance to puncture, shear, or tear in the application environment. This product optimizes the long-term reliability and performance of electronic devices in high stress applications and environments.