maxiFLOW™ pushPIN™ Heat Sink

Advanced Thermal Solutions, Inc. introduces a new series of its maxiFLOW heat sinks which now include an integral pushPIN mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components.

Each heat sink comes with a pair of durable push pins in a choice of plastic or brass. The pins push mount easily and securely into 3.00 mm holes in the PCB. The holes are positioned in industry standard patterns. Plastic pins are lighter and non-electrically conductive; brass pins have added strength and durability for more rugged applications or thicker devices. An integral spring on each pin provides approximately 2 lbs of retention load, depending on the height of the component being cooled and the PCB thickness.

Through holes for the pins are on opposite corners on the base of the maxiFLOW heat sinks. The patented ATS maxiFLOW sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling in the restricted airflow conditions typical of today’s condensed electronic packages. The heat sinks are fabricated from extruded aluminum which minimizes thermal resistance from the base to the fins, reduces weight, and keeps costs low. They have a protective green anodized surface.