Use Hertz Stress as a predictive performance indicator.

This paper discusses the different fault-prone points of a BESS, and how to adequately size the fuse for optimal overcurrent protection.

This paper will go over everything you need to know to understand which fuse is best for your application.

In this report, we will explain the risks of choosing a lowquality SSR and share the test results of the Littelfuse products compared to two other suppliers.

This white paper informs specifying engineers, original equipment manufacturers, designers, and end users about the most important features in arc-flash relay technology so that they can select the best relay for their application.

This paper will begin with a brief overview of the conditions that make an electrical shock hazard potentially lethal (which aims to help readers understand why lower voltages do not constitute safer conditions).

This white paper outlines the important extended service life and enhanced reliability reasons designers should evaluate using Bourns® IsoMOV® protectors given their compliance with UL 1449 for North America and IEC 61051-2 for EMEA.

Compact fans from ebm-papst are extremely powerful, even in the smallest of spaces.

Energy-efficient and quiet fans for residential ventilation.

Vertical farming: From a trend to future technology.

This paper discusses the impact of the ESD protection device on SI in comparison to other link components such as cable, connector and the PCB in a differential Video Link.

This paper discusses the operation, structure and design considerations of Nexperia’s portfolio of RETs, and considers the suitability of new, 80 V parts that target emerging 48 V EV systems.

The Trench Schottky diode is a development on the original Schottky diode, providing greater capabilities than its planar counterpart. In this paper the structure and the benefits of Trench Schottky rectifiers are discussed.

This white paper describes the structure and applications of SiC diodes and explains their advantages over silicon devices.

The objective of the following white paper is to provide readers with a better understanding of all the engineering and logistical challenges that are associated with large-scale Internet of Things (IoT) deployment and the ongoing operation of each of its constituent nodes.

In this article, we will explore the impact of a modern ESD protection on the SI using full-wave 3D modeling techniques. Consequently, the findings will be examined in the frequency domain, specifically in relation to scattering parameters and time domain reflectometry (TDR).

Choosing the right SD and microSD card requires careful evaluation of application requirements, manufacturer support, and long-term reliability to ensure optimal performance in industrial environments.

In this whitepaper, we introduce ODU AMC® High-Density (the original High-Density connector, trusted since 2013) with a new high power insert – and the newer ODU AMC® NP – with the roles they play in enabling secure end-to-end connectivity.

In this paper we evaluate some of the limiting factors related to the design and manufacture of equipment used by soldiers and in ground robotic systems, drawing special attention to connector selection.

Connector manufacturers like ODU can play a decisive role in facilitating the certification process by helping the device manufacturer achieve compliance with IEC 60601, and also otherwise reducing risk in the overall supply chain