Settings
Fast Delivery
Free Shipping
Incoterms
Payment Types
Marketplace Product
Slide 1
Slide 2
Slide 3
Slide 4
Slide 5
Slide 6
Slide 7
Slide 8
Slide 9
Slide 10
Slide 11
Slide 12
Slide 13
Slide 14
Slide 15
Slide 16
Slide 17
Slide 18
Slide 19
Slide 20
Slide 21
Slide 22
Slide 23
Slide 24
Slide 25
Slide 26
Slide 27
Slide 28
Slide 29
Slide 30
Slide 31
Slide 32
Slide 33
Slide 34
Slide 35
Slide 36
Slide 37
Slide 38
Slide 39
Slide 40
Slide 41
Slide 42
Product List
This slide illustrates a technique for probing a small geometry, high density IC, using a copper pad and the ground blade for a short path to ground. Using an insulated tip prevents shorting the probe to the adjacent legs.
PTM Published on: 2012-04-26
Hong Kong, China