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Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.

12/28/2020 2:12:58 PM

Part List

圖片製造商零件編號說明現有數量價格查看詳情
CONN SPRING MOD 25POS SMD3800520001CONN SPRING MOD 25POS SMD1 - 即時供貨$808.38查看詳情
CONN SPRING MOD 51POS SMD3800520013CONN SPRING MOD 51POS SMD0 - 即時供貨$757.84查看詳情
CIN::APSE STACKING HARDWRE 25POS3180299353CIN::APSE STACKING HARDWRE 25POS0 - 即時供貨$252.64查看詳情
CIN::APSE STACKING HARDWRE 51POS3180299356CIN::APSE STACKING HARDWRE 51POS0 - 即時供貨$281.37查看詳情
CABLE FFC/FPC 25POS 0.64MM 3"4631533093CABLE FFC/FPC 25POS 0.64MM 3"12 - 即時供貨$154.43查看詳情
CABLE FFC/FPC 51POS 0.64MM 3"4631533094CABLE FFC/FPC 51POS 0.64MM 3"0 - 即時供貨$154.43查看詳情

Related Product Highlight

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