Historically, Hall sensors have suffered from insufficient accuracy, poor current resolution, and slow output response times. However, Allegro’s recent advances in Hall sensor circuit technology, when coupled with Allegro patented flip chip packaging technology, have made Hall sensors a preferred current sensing solution in many energy efficient applications. The primary conductor inside the package employs a ¾ loop topology as seen in figure (A). The Hall element is on the surface of the semiconductor die and the die is connected to the secondary leads via solder bumps. These solder bumps are plated on the die and then reflowed to make electrical connection to the lead-frame as shown in figure (B). The secondary pins support the die and allow it to hover over the primary leads or conductor. The die does not touch the primary conductor, maintaining the galvanic isolation of the package. The ¾ loop and the close proximity of the die to the primary current conductor provides a high level of signal coupling and a high signal-to-noise ratio. This high level of signal coupling increases the accuracy and current sensing resolution of the ACS710 device. The current to be sensed flows into and out of the eight primary-side pins. The primary current path pins and the secondary signal pins are isolated by the package case molding plastic as shown in figure (C) which maintains the galvanic isolation in the complete package. Additional dielectric materials, also patented by Allegro, are also used to maintain high levels of primary to secondary voltage isolation within the IC.