MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

Related Parts

圖片製造商零件編號說明附著方法形狀現有數量價格查看詳情
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MM熱編帶、黏合劑 (包含)方形、角狀散熱片100 - 即時供貨$94.84查看詳情
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MM夾片、熱介面材料方形、角狀散熱片0 - 即時供貨$102.62查看詳情
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MM熱編帶、黏合劑 (包含)方形、角狀散熱片187 - 即時供貨$84.24查看詳情
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MM夾片、熱介面材料方形、鰭片615 - 即時供貨$102.56查看詳情
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MM夾片、熱介面材料方形、角狀散熱片975 - 即時供貨$125.63查看詳情
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MM夾片、熱介面材料方形、角狀散熱片65 - 即時供貨$124.07查看詳情
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MM夾片、熱介面材料方形、角狀散熱片32 - 即時供貨$122.10查看詳情
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MM夾片、熱介面材料方形、角狀散熱片100 - 即時供貨$122.92查看詳情
HEAT SINK 19MM X 19MM X 9MMATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MM熱編帶、黏合劑 (包含)方形、角狀散熱片1922 - 即時供貨$64.05查看詳情
PTM Published on: 2011-10-13

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

發佈日期：2018-01-26

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

發佈日期：2012-10-15

Related Product Highlight

散熱片附件解決方案 Advanced Thermal Solutions 的散熱片附件為工程師提供多種選項，可將幾乎任何散熱片機械地附加到 PCB 上。
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.