Tflex™ 700 Series

5 W/mK soft gap filler thermal interface material from Laird Thermal

Tflex™ 700 SeriesLaird Thermal's Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Tflex 700's unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex 700 is naturally tacky and requires no additional adhesive coating to inhibit thermal performance. Tflex 700 is electrically insulating and stable from -45°C thru +200°C. It also meets UL 94V0 flame rating.

Features
  • Thermal conductivity 5.0 W/mK
  • Highly compliant
  • Lowest thermal resistance even at low pressure
  • Available in thicknesses from 0.020" to 0.200" (0.5 mm to 5.0 mm)
  • Naturally tacky for adhesion during assembly and transport
Applications
  • Cooling components to chassis, frame, or other mating components
  • Mass storage devices
  • Heat pipe thermal solutions for the notebook computers
  • Automotive engine control
  • Telecommunication hardware
  • LED solid state relay lighting
  • Power electronics
  • Flat panel displays
  • Audio and video components
  • Computer servers and other IT infrastructure
  • GPS navigation and other portable devices

Tflex 700 Series

圖片製造商零件編號說明現有數量價格
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發佈日期: 2012-06-29