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Shown here is a chart that shows the octane performance of PCM materials, compared to PC-99, with respect to thermal impedance at a 1 mil bond line thickness (BLT). Essentially, the lower the thermal impedance the better the thermal transfer characteristics. However, this is not the only parameter to consider when selecting the material as cost and other parameters, such as re-workability or dielectric breakdown strength also need to be considered.
PTM Published on: 2013-05-21
Hong Kong, China