Comchip’s flat chip diodes are Eu/China RoHS Compliant and have gold plated termination instead of tin. Tin-Free packages means no Tin-Whisker potential and improved long-term reliability. The Gold plated termination works with most solder and assembly processes. The substrate construction of the flat chip packages is simpler than the lead-frame, requires less steps, and results in lower cost and higher quality diodes. The flat underside of the DFN/QFN packages allow the diodes to stay put during the placement process and they do not roll off, shift axis, or get cracked like the glass MELF packages. Rolling, shifting, and tomb-stoning problems during assembly, common with MELF and lead-frame packages, are all minimized. The dimensions of the flat chip packages are designed so they are drop-in replacements for 2-pin lead-framed or MELF packages of similar dimensions. Compared to the lead-framed package, termination on flat chip packages are much bigger, making pick-and-place operation much easier and accurate. Reduced problems and rework means lower cost for users of flat chip packages.