These pictures show the substrate-based manufacturing process of Comchip’s DFN/QFN flat chip diodes packages. Beginning with a pre-formatted piece of substrate specific to the finished package, during the die bond step, the silicon chip first needs to be attached to the substrate. Next, wire bonding is performed to make the internal electrical connection, from one end of the terminal to the attached chip, through the wire and to the other end of the terminal. Molding for the entire substrate is performed in one step, followed by marking of the cathode band and marking code of product. The substrate of diodes are then diced into each finished part, cleaned, individually tested, and put on carrier tape.