The standard manufacturing process for lead-framed packages requires 13 steps, including lead-frame forming, lead-frame plating, and removing excess lead-frame materials. Using substrate instead of lead-frame, Comchip manufactures the flat chip packages in 7 major steps: die bond, wire bond, molding, marking, dicing, cleaning and test & taping. The simplified manufacturing process results in cost savings, higher quality, better reliability, and higher yield. Part of the cost savings offsets the higher cost of gold plated terminals to achieve the tin-free RoHS benefit. Overall cost of flat chip packages remains competitive with their lead-frame counterparts.