There are three components to Comchip’s design concept: size reduction, improved performance and environmental friendliness. Size reduction is achieved by eliminating lead-frame in the diode package. The substrate based flat chip packages are easier to cut into smaller and smaller sizes, and the DFN (Dual Flat No-lead)/QFN (Quad Flat No-lead) packages can be made into lower profile versions of the lead-frame counterparts. For portable and handheld devices, DFN/QFN packages offer easy placement and high-speed production. Improved performance is possible with higher power density per package. One way is to keep the same current or voltage rating while reducing package size. The alternate is keep the same package size but allow higher current or voltage performance. This is achieved by new internal structure, new manufacturing process, as well as better materials suited for improved thermal dissipation. Environmental concerns are addressed with the control and safeguard of raw materials and the proper treatment needed. Meticulous handling of chemicals and wastes before, during and after production is enforced to ensure minimized impact on the environment. Comchip’s factory is ISO 14001 certified, and since 2001 Comchip flat chip diodes are RoHS compliant and achieve the compliance with Tin-Free termination, hence eliminating Tin-Whisker potential from using the components. Since 2007, Halogen-free versions are available.