Body Electronics and Power Management

onsemi supplies application-specific standard products (ASSPs) for door module electronics, including CAN- and LIN-enabled system basis chips (SBCs) designed specifically for door modules. Smart power bipolar-CMOS-DMOS (BCD) technology enables the integration of powerful driver stages that may be used for door locks, mirror folding and heating, and lamp drivers. The integration of complex state machines and pulse width modulation (PWM) control units creates components that are flexible enough to drive different types of lamps and motors. Standard products like multiplex devices, amplifiers, MOSFETs, bus, and supply protection components allow onsemi the opportunity to support complete customer designs.

Door electronics are prevalent in modern vehicles with most automobiles containing electronic window lifts and central locks. Additional safety features, like pinch protection and child-proof locks, increase the electronic content in door modules. Other available features include side mirror positioning, folding, and defrosting, and for high-end models, electrochromic mirror control that darkens the mirror depending on the brightness of the irradiated beam of oncoming traffic. Some lamp applications, like flashers in the mirror or LEDs for interior lighting, are also being adopted.

Centralized Door Electronics System

The most common topology is centralized electronics, where the electronics system is implemented in the body control unit (BCU). onsemi offers:

• In-vehicle networking: CAN transceivers, LIN transceivers, and SBCs
• Voltage regulators
• Load drivers for motors, lamps, and relay controls
• Logic functions
• Discrete components: diodes, transistors, and protection devices

Decentralized Door Electronics System

As the electronics content becomes more complex, the large number of wires drive designs toward a decentralized topology. The decentralized door modules communicate over a CAN or LIN bus system. onsemi offers:

• Reduced use of wiring harness
• Reduced weight and power consumption
• Enabled module architectures through the use of sub-modules