Solder preforms, wire, and ribbon are manufactured and packaged to minimize oxidation. Since no container offers complete isolation from oxygen in ambient air, solder will slowly oxidize, which may result in a reduction in wetting.

The alloys in this book are the result of decades of listening to our customers and finding solutions that enable cutting-edge technologies

Metal Thermal Interface Materials (TIMs) aid in the transfer of heat between surfaces and minimize the thermal resistance at each device connection.

For high-power devices, the performance of interconnect materials within the packaging is critical to achieve efficiency and longevity.

The automotive industry, emerging electric vehicles, and wafer-level packages with smaller pitch sizes demand higher reliability of solder joints, namely, the elongated lifetime and/or the survival of more aggressive service conditions, than the mainstream SAC305.

The theoretical volume of solder paste can be calculated for each board using the Greely Formula and a simple volume calculation.

Durafuse® LT serves as a high-reliability solution to several different application challenges employing a vast array of reflow processes to achieve different results.

Indium metal is extracted primarily from indium-bearing zinc or tin ores and purified to various grades utilizing state-of-the-art statistical process-controlled refining technologies.

Indium flux and solder compatibility application note.

Reducing the energy consumed by the reflow oven has a direct impact on reduced CO2 emissions. In addition to quantifying the energy consumed, there is a growing emphasis on the Life Cycle Assessment (LCA) of a product.

A manufacturer can choose either a rosin-containing or a non-rosin-containing flux based on the solvent used, the ratio of flux to solvent, and the current cleaning process, to name a few.

One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom terminated components to PCBs.

Indium Corporation 生產的焊條超越表面黏著產業嚴格的品質要求，提供更穩定、更可靠的效能。

Indium Corporation 生產的實心焊錫線符合 ASTM B-32、J-STD-006、JIS-Z-3282 的嚴格品質標準。

CW-807 相容於所有 Indium Corporation 免清洗焊膏、波峰焊接焊劑、常見的軟焊料合金。

Indium 條狀焊錫片是由電子級錫條切割而成的小片，用於填充小型焊錫爐，或加快新焊錫爐中焊錫的熔化速度。

Indium 的 Indium6.6HF 水溶性焊膏適用於 SnPb 及無鉛組裝製程，並具備卓越的迴流焊接製程窗口。

Indium CW-219 高活性、高效能的免清洗包藥焊線特別適用於機械手臂焊接及手工焊接高度氧化的表面。

Indium 這款技術先進的助焊筆每支含有 10 ml 焊劑，具有卓越的洩漏控制功能和分配能力。

Indium CW-818 包藥焊線具備耐高溫、低飛濺特性，可確保組件具有優異的外觀品質。