To do this, consider a simulation study of the 2-level grid-tied converter shown here, which has been implemented in PLECS with a grid voltage of 480 V_RMS line-to-line, line inductors of 100 µH, and an 800 V_DC bus. This is assuming there is an FM3-based solution present where the designer utilizes the 11 mΩ half-bridge FM3 module. For this module implementation, using a decently high-switching frequency of 50 kHz, the system is maxed-out at 75 kW before reaching the rated junction temperature of +150°C. Consider this as the baseline system from which the designer wants to scale or upgrade with the GM3. For this first example, the user should consider an upgrade to the system with the 8 mΩ GM3 half-bridge module. By simply inserting the 8 mΩ GM3 into the 75 kW, 50 kHz system, the maximum operating junction temperature can be reduced from +150°C to +114°C. This could be desirable to enhance power cycling lifetime of the system or to enable a higher heatsink temperature to be used. Next, if the design goal is to increase power, now the 50 kHz system can achieve 100 kW before the junction temperature rating is reached. Likewise, for the 75 kW baseline, the switching frequency can be increased to 85 kHz to provide other system-level benefits. So now looking at the bounds of how each system parameter can be upgraded with the GM3 depending on what the design scalability goal is, the power or switching frequency can be increased, the junction temperature can be decreased, or a combination of all three can be achieved.