IPD is a subcategory of the IPAD™ (Integrated Passive and Active Devices) product family. These are devices built using thin-film on silicon or glass substrates. Shown on the bottom left-hand of this slide is the die cross-section for ST’s thin-film on Si devices which are used in baseband applications like HDMI, SD card, and USB interfaces to provide ESD protection and EMI filtering. On the bottom right-hand is the cross-section for thin-film on glass process which is used to develop RF passives for cellular, Bluetooth, WiFi, and other wireless applications. This will be the focus of this presentation. Diffusing metal layers on a non-conductive glass substrate allows ST to achieve low insertion losses and a high Q-factor which are important parameters for RF design.