Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Slide 12 Slide 13 Slide 14 Slide 15 Slide 16 Slide 17 Slide 18 Slide 19 Slide 20 Slide 21 Slide 22 Slide 23 Slide 24 Product List
RF IPDs Overview Slide 21

ST offers flexibility the to integrate IPD into an application. On this slide is shown the different packaging options available. IPD can be wire-bonded to another substrate for a system-in-package application. These devices can also be provided in µbumped die which is also suitable for system-in-package integration. The other option is to have the IPD in a regular bumped die, with a total thickness less than 650 µm. This type of package is suitable for stand-alone passive applications.

PTM Published on: 2013-02-27