An important feature of the OmniOn Power point-of-load products are that they are designed to be part of a modular and interchangeable palette of solutions. There are three separate footprints: the PICO, the MICRO, and the MEGA. The footprint of the 2A module is the PICO. This DOSA solution is part of a dual footprint capability, meaning the PICO and the MICRO use a dual footprint that allows the user to move quickly between one size and the next. This is important because usually when engineers begin a design, they don’t know exactly what current they will need, so they may begin to design with a MICRO package, say 10 amps, and then find out they need less. If this happens, they can cost reduce to a PICO package at 6 amps. This provides engineers the ability to move to a very quick cost reduction, or in case the need more power, they can scale up with a dual footprint.