The thermal management needs are comprised of four key elements, each will play an important role in providing the total solution. Packaging of Flip-Chips and their relatively small heat source areas put the emphasis on high performance TIMs – phase-change and thermal grease. PCB Designers and Thermal Engineers are then forced to use a mechanical method of heat sink attachment (double sided thermal tape does not provide sufficient thermal conductivity). The ever increasing need for higher PCB routing density and higher component power levels combine to make using the traditional methods of heat sink attachment (PEM type stand-offs, compression springs, and screws) less desirable and in some cases unacceptable. The use of “direct attach” type heatsink clips has become more and more desirable and in some cases the only option. ATS has combined the innovative maxiGRIP™ attachment clip with its very successful maxiFLOW™ heatsink to optimize the thermal performance and avoid the problems associated signal routing.