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FlipChip-Slide2

To understand the need for maxiGRIP™, a person first needs to understand the Flip-Chip BGA construction and the challenges it presents. This module will review the cooling requirements from the die level through to the importance of selecting the correct TIM (thermal interface material). The design of the maxiGRIP™ components will be explained and the significance each will become evident. The conclusions will provide a summary of the maxiGRIP™ advantages and conformance to the industry requirements.

PTM Published on: 2011-10-13