i.MX 8ULP Applications Processor

NXP's i.MX 8ULP applications processor is designed for general consumer and industrial applications requiring energy efficiency, a rich user interface, human-machine interface (HMI), and security. With customizable low-power-mode efficient technology, the i.MX 8ULP is an ideal applications processor for ultra-low-power applications with rich 2D and 3D graphics and secure Edge computing.

The i.MX 8ULP applications processor brings core performance with fine-grained, ultra-low-power modes, energy flex architecture to optimize power consumption, dedicated GPUs with support for rich 3D and 2D graphics, and both Linux® and Android™ support along with multi-sensory data processing engines (graphics, image, display, audio, and voice) and state-of-the-art EdgeLock® secure enclave to provide a secure, connected experience.

A continuation of the ultra-low-power MPUs in the i.MX 6, i.MX 7, and i.MX 8 series, i.MX 8ULP SoCs provide enhanced features, performance, and energy efficiency compared to its predecessors. It can be utilized for a range of energy-efficient applications needing power, performance, and standard supported features, including wearables, low-power smart home devices, displays, e-readers, industrial devices, and more.

i.MX 8ULP applications processors enable low-power applications for IoT and industrial applications with advanced security EdgeLock secure enclave integration to support secure energy-efficient Edge computing.

The i.MX 8ULP family consists of dual Arm® Cortex®-A35 cores for scalable performance and NXP’s innovative energy flex architecture implementation that uniquely combines heterogeneous domain computing, design techniques, and process technology for intrinsic support of the processor's fine-tuning capabilities.

A dedicated power management subsystem offers more than ten validated power mode combinations to deliver exceptional efficiency across a range of applications. The SoCs also offer a rich set of peripherals targeting industrial and consumer IoT market segments.

The i.MX 8ULP EVKs using the 15 mm x 15 mm and 9.4 mm x 9.4mm sample provides a platform for comprehensive evaluation of the i.MX 8ULP applications processors and includes the ability to measure power consumption on the power rails.

The MCIMX8ULP-EVK and MCIMX8ULP-EVK9 board solution consists of a computer module that contains i.MX 8ULP SoC (MIMX8UD7CVP08SC for 15 mm x 15 mm and MIMX8UD5DVK08SC for 9.4 mm x 9.4 mm), LPDDR4, eMMC, PCA9460 PMIC, and power monitoring circuits, enabling fast use case evaluation through quick builds of dips customized baseboards. The MCIMX8ULP-EVK kit provides an excellent starting point to accelerate designs.