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Bergquist's SIL PAD TSP 3500 is a silicone elastomer formulated to maximize the dielectric and thermal performance.

Bergquist's GAP FILLER TGF 3600 is a two-component, liquid gap-filling material featuring ultra-high thermal performance.

Henkel LOCTITE® Bergquist® is the world’s leading developer and manufacturer of thermal management materials which include Sil-Pad®, thermally conductive insulators and various specialty materials; Gap Pad®, gap filling materials, Hi-Flow®, phase change materials, Softface® and Bond-Ply®.

Thermal management of power electronics, whether power supplies or power components, requires interfacing the package to a heat sink using a thermal interface material (TIM).

Advanced communication technologies, motor controls, drives and power converters are delivering more function in smaller form factors, which raises power densities and increases heat generation.

Bergquist’s Gap Pad® TGP 6000ULM silicone-based, nonelectrically conductive Gap Pad is highly conformable, providing excellent coverage on various topographies.

Bergquist’s Gap Pad® TGP 7000ULM soft gap-filling material is rated at 7.0 W/m-K and formulated for high-performance applications requiring low assembly stress.

LOCTITE STYCAST 2850FT thermally conductive epoxy encapsulant is designed to encapsulate components requiring heat dissipation and thermal shock properties.

GAP PAD®, SIL PAD®, & HI-FLOW Ordering Information

As you are aware, Henkel acquired The Bergquist Company in late 2014. Since then, Henkel has been integrating the Bergquist organization and analyzing the parallel IT systems in an effort to create minimal disruption once the IT systems are brought together

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.

Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.

Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.

The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.