GAP FILLER TGF 3600

Bergquist's GAP FILLER TGF 3600 (formerly known as GAP FILLER 3500S35) is a two-component, liquid gap-filling material featuring ultra-high thermal performance and outstanding softness. This material can be cured at either room temperature or it can be cured much faster at an elevated temperature. Before curing, the material maintains good thixotropic characteristics as well as low viscosity. The result is an easily dispensable gel-like liquid material designed to flow into and fill air gaps and voids. The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a low-modulus elastomer designed to assist in relieving the coefficient of thermal expansion (CTE) stresses during thermal cycling, yet maintains enough modulus to prevent pump-out from the interface. Bergquist's GAP FILLER TGF 3600 will lightly adhere to surfaces, thus improving surface area contact. Bergquist's GAP FILLER TGF 3600 is not designed to be a structural adhesive.