Henkel LOCTITE® Bergquist®

Henkel Adhesive Electronics, a division of the global materials innovator Henkel Corporation, focuses on developing next-generation materials for various applications in industrial, telecom and datacom infrastructure, avionics, power conversion, handheld, wearables, display, and other emerging electronics sectors. Henkel's leading electronics brand, LOCTITE® Bergquist®, is renowned for its reliability and performance in printed circuit board assembly applications. With a broad portfolio including surface mount adhesives, thermal management materials, CSP underfills, and board protection materials, Henkel's advanced formulations ensure maximum processability and reliable in-field performance.

LOCTITE® - Henkel's LOCTITE® brand is synonymous with quality, reliability, and high performance in the electronics sector. It encompasses underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive, and conformal coating product lines.

Henkel LOCTITE® Bergquist® - Now part of Henkel, the Bergquist® line delivers superior heat control for challenging applications. Known for GAP PAD® materials, SIL PAD® materials, phase change materials, microTIMs, LIQUI-FORM® products, BOND PLY® and thermal adhesives, Henkel's thermal materials portfolio ensures effective heat management from substrate level to final assembly.

Henkel LOCTITE® Bergquist® brand thermal management materials offer a broad range of solutions for reliable heat dissipation in modern electronic devices. GAP PAD® gap filling thermal interface materials (TIMs) reduce assembly stress while providing excellent thermal conductivity. Liquid Gap Filler TIMs are suitable for applications with complex dimensions or high throughput requirements. The portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, and HI FLOW® phase change materials.