Webinar – Silicon Carbide and Multi-Technology Solutions in Novel Isolated Packages

As Silicon Carbide (SiC) technology continues to revolutionize both industrial and automotive sectors, the race to achieve higher power density and system efficiency is intensifying. Switching performance, thermal management, and design for manufacturability (DFM) remain as persistent challenges for new SiC devices and Multi-Technology Solutions.

Join Roderick Smith, NA Power Semiconductor/IC Business Development Manager of Littelfuse Inc. for an exclusive webinar showcasing cutting-edge SiC packaging innovations and protection solutions designed to overcome these hurdles and elevate your system design.

What You’ll Learn:

• Innovative SiC Packaging
  Dive into isolated discrete and multichip solutions like SMPD (Surface Mount Power Device) and TO247 packages in 3-lead and 4-lead configurations.
• Cost-Effective SiC Offerings
  Explore Littelfuse’s standard low-cost SiC devices (650 V – 1.7 kV) in popular formats including 4L247, D2PAK, DPAK, TOLL, and QDPAK.
• Next-Gen Gate Drivers
  Discover isolated, SiC-optimized gate drivers engineered to boost performance and reliability.
• Robust System Protection
  Learn how asymmetrical TVS devices provide enhanced protection against transient voltage threats in SiC-based systems.

Join Us!

Whether you're designing for high-efficiency power conversion or pushing the boundaries of thermal performance, this session is packed with insights to help you harness the full power of SiC.

When: Wednesday, October 22, 2025, 10:00 AM CDT

Length: 1 hour

Register here to attend or receive the full recording at any time following the event: https://event.on24.com/wcc/r/5093519/D127FC8AA26703B439A7B6EB5552D690?partnerref=blog