Venting built into the device packaging allows for convection cooling in the application environment to naturally cool the electronics. Sometimes heatsinks are needed to ensure sufficient cooling of sensitive and powerful electronics. The ICS has both integrated venting in most sizes, as well as optional vented plates for additional heat dissipation. Phoenix Contact also offers heatsinks that integrate directly into the ICS enclosure and can easily be machined to match the profile of the PCB components that require direct cooling. In addition, Phoenix Contact offers online thermal simulation tools and engineering support to ensure complete confidence in a designs performance.