MTA18ASF4G72PZ Addendum 規格書

規格書意見回饋／錯誤

Micron DDR4 SDRAM RDIMM

32GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

Features

CCM005-341111752-10523 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

DDR4 SDRAM RDIMM

Addendum

MTA18ASF4G72PZ – 32GB

Features

Information provided here is in addition to or super-

sedes information provided in the Micron DDR4

RDIMM Core data sheet.

•DDR4 functionality and operations supported as

defined in the component data sheet

•Features and specifications defined in the Micron

DDR4 RDIMM Core data sheet

•288-pin, registered dual in-line memory module

(RDIMM)

•Fast data transfer rates: PC4-3200, PC4-2933

•32GB (4 Gig x 72)

•Single-rank

•16 internal banks; 4 groups of 4 banks each

Figure 1: 288-Pin RDIMM

Options Marking

•Operating temperature

–Commercial (0°C ≤ TOPER ≤ +95°C) None

•Package

–288-pin DIMM (halogen-free) Z

•Frequency/CAS latency

–0.625ns @ CL = 22 (DDR4-3200) -3G2

–0.682ns @ CL = 21 (DDR4-2933) -2G9

Table 1: Addressing

Parameter 32GB

Row address 256K A[17:0]

Column address 1K A[9:0]

Device bank group address 4 BG[1:0]

Device bank address per group 4 BA[1:0]

Device configuration 16Gb (4 Gig x 4), 16 banks

Module rank address 1 CS0_n

asf18c4gx72pz.ditamap Page 1

Primary Side

Secondary Side

U15

U14

U13

U12

U11

U10

U20

U19

U18

U17

U16

U2 U6

CCM005-341111752-10523 Micron Technology, Inc. reserves the right to change products or specifications without notice.

32GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

Features

Table 2: Part Numbers and Timing Parameters – 32GB Modules

Base device: MT40A4G4,1 16Gb DDR4 SDRAM

Notes: 1. The data sheet for the base device can be found on micron.com.

2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.

Consult factory for current revision codes. Example: MTA18ASF4G72PZ-3G2F1.

Part Number2Module

Density

Configuration Module

Bandwidth

Memory Clock/

Data Rate

Clock Cycles

(CL-nRCD-nRP)

MTA18ASF4G72PZ-3G2__ 32GB 4 Gig x 72 25.6 GB/s 0.625ns/3200 MT/s 22-22-22

MTA18ASF4G72PZ-2G9__ 32GB 4 Gig x 72 23.47 GB/s 0.682/2933 MT/s 21-21-21

asf18c4gx72pz.ditamap Page 2

CCM005-341111752-10523 Micron Technology, Inc. reserves the right to change products or specifications without notice.

32GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

Important Notes and Warnings

Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,

including without limitation specifications and product descriptions. This document supersedes and replaces all

information supplied prior to the publication hereof. You may not rely on any information set forth in this document

if you obtain the product described herein from any unauthorized distributor or other source not authorized by

Micron.

Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi-

cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-

utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,

costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of

product liability, personal injury, death, or property damage resulting directly or indirectly from any use of

non-automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and

conditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron

products are not designed or intended for use in automotive applications unless specifically designated by Micron

as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to

indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'

fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage

resulting from any use of non-automotive-grade products in automotive applications.

Critical Applications. Products are not authorized for use in applications in which failure of the Micron component

could result, directly or indirectly in death, personal injury, or severe property or environmental damage ("Critical

Applications"). Customer must protect against death, personal injury, and severe property and environmental

damage by incorporating safety design measures into customer's applications to ensure that failure of the Micron

component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron compo-

nent for any critical application, customer and distributor shall indemnify and hold harmless Micron and its subsid-

iaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims, costs,

damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product

liability, personal injury, or death arising in any way out of such critical application, whether or not Micron or its

subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the Micron

product.

Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,

applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT

FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE

WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR

PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in

customer's applications and products to eliminate the risk that personal injury, death, or severe property or envi-

ronmental damages will result from failure of any semiconductor component.

Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential

damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such damages are based on tort, warranty, breach

of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly autho-

rized representative.

asf18c4gx72pz.ditamap Page 3

CCM005-341111752-10523 Micron Technology, Inc. reserves the right to change products or specifications without notice.

32GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

DQ Map

Table 3: Component-to-Module DQ Map

Component

Reference

Number

Component

DQ Module DQ

Module Pin

Number

Component

Reference

Number

Component

DQ Module DQ

Module Pin

Number

U2 0 3 157 U3 0 11 168

1 1 150 1 9 161

2 2 12 2 10 23

3 0 5 3 8 16

U4 0 19 179 U5 0 27 190

1 17 172 1 25 183

2 18 34 2 26 45

3 16 27 3 24 38

U6 0 CB3 201 U8 0 35 249

1 CB1 194 1 33 242

2 CB2 56 2 34 104

3 CB0 49 3 32 97

U9 0 43 260 U10 0 51 271

1 41 253 1 49 264

2 42 115 2 50 126

3 40 108 3 48 119

U11 0 59 282 U12 0 60 128

1 57 275 1 62 135

2 58 137 2 61 273

3 56 130 3 63 280

U13 0 52 117 U14 0 44 106

1 54 124 1 46 113

2 53 262 2 45 251

3 55 269 3 47 258

U15 0 36 95 U16 0 CB4 47

1 38 102 1 CB6 54

2 37 240 2 CB5 192

3 39 247 3 CB7 199

U17 0 28 36 U18 0 20 25

1 30 43 1 22 32

2 29 181 2 21 170

3 31 188 3 23 177

U19 0 12 14 U20 0 4 3

1 14 21 1 6 10

2 13 159 2 5 148

3 15 166 3 7 155

asf18c4gx72pz.ditamap Page 4

CCM005-341111752-10523 Micron Technology, Inc. reserves the right to change products or specifications without notice.

32GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

IDD Specifications

Table 4: DDR4 IDD Specifications and Conditions – 32GB (Die Revision E)

Values are for the MT40A4G4 DDR4 SDRAM only and are computed from values specified in the 16Gb (4 Gig x 4) component

data sheet.

Parameter Symbol 3200 2933 Units

One bank ACTIVATE-PRECHARGE current IDD0 990 972 mA

One bank ACTIVATE-PRECHARGE, word line boost, IPP current IPP0 54 54 mA

One bank ACTIVATE-READ-PRECHARGE current IDD1 1188 1170 mA

Precharge standby current IDD2N 810 792 mA

Precharge standby ODT current IDD2NT 918 900 mA

Precharge power-down current IDD2P 684 684 mA

Precharge quite standby current IDD2Q 756 756 mA

Active standby current IDD3N 1080 1062 mA

Active standby IPP current IPP3N 36 36 mA

Active power-down current IDD3P 864 846 mA

Burst read current IDD4R 2286 2142 mA

Burst write current IDD4W 1890 1818 mA

Burst refresh current (1x REF) IDD5R 1224 1224 mA

Burst refresh IPP current (1x REF) IPP5R 72 72 mA

Self refresh current: Normal temperature range (0°C to 85°C) IDD6N 954 954 mA

Self refresh current: Extended temperature range (0°C to 95°C) IDD6E 2034 2034 mA

Self refresh current: Reduced temperature range (0°C to 45°C) IDD6R 360 360 mA

Auto self refresh current (25°C) IDD6A 198 198 mA

Auto self refresh current (45°C) IDD6A 360 360 mA

Auto self refresh current (75°C) IDD6A 918 918 mA

Auto self refresh current (95°C) IDD6A 2034 2034 mA

Auto self refresh IPP current IPP6X 108 108 mA

Bank interleave read current IDD7 3546 3510 mA

Bank interleave read IPP current IPP7 162 162 mA

Maximum power-down current IDD8 648 648 mA

asf18c4gx72pz.ditamap Page 5

00000

CCM005-341111752-10523 Micron Technology, Inc. reserves the right to change products or specifications without notice.

32GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

IDD Specifications

Table 5: DDR4 IDD Specifications and Conditions – 32GB (Die Revision B)

Values are for the MT40A4G4 DDR4 SDRAM only and are computed from values specified in the 16Gb (4 Gig x 4) component

data sheet.

Parameter Symbol 3200 2933 Units

One bank ACTIVATE-PRECHARGE current IDD0 1080 1062 mA

One bank ACTIVATE-PRECHARGE, word line boost, IPP current IPP0 72 72 mA

One bank ACTIVATE-READ-PRECHARGE current IDD1 1260 1242 mA

Precharge standby current IDD2N 936 918 mA

Precharge standby ODT current IDD2NT 1008 990 mA

Precharge power-down current IDD2P 774 774 mA

Precharge quite standby current IDD2Q 846 846 mA

Active standby current IDD3N 1404 1386 mA

Active standby IPP current IPP3N 54 54 mA

Active power-down current IDD3P 1242 1224 mA

Burst read current IDD4R 3096 2952 mA

Burst write current IDD4W 2952 2826 mA

Burst refresh current (1x REF) IDD5R 1422 1404 mA

Burst refresh IPP current (1x REF) IPP5R 90 90 mA

Self refresh current: Normal temperature range (0°C to 85°C) IDD6N 1206 1206 mA

Self refresh current: Extended temperature range (0°C to 95°C) IDD6E 2178 2178 mA

Self refresh current: Reduced temperature range (0°C to 45°C) IDD6R 522 522 mA

Auto self refresh current (25°C) IDD6A 180 180 mA

Auto self refresh current (45°C) IDD6A 522 522 mA

Auto self refresh current (75°C) IDD6A 1098 1098 mA

Auto self refresh current (95°C) IDD6A 2178 2178 mA

Auto self refresh IPP current IPP6X 198 198 mA

Bank interleave read current IDD7 4284 4158 mA

Bank interleave read IPP current IPP7 198 198 mA

Maximum power-down current IDD8 720 720 mA

asf18c4gx72pz.ditamap Page 6

00000

CCM005-341111752-10523 Micron Technology, Inc. reserves the right to change products or specifications without notice.

32GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

IDD Specifications

Table 6: DDR4 IDD Specifications and Conditions – 32GB (Die Revision F)

Values are for the MT40A4G4 DDR4 SDRAM only and are computed from values specified in the 16Gb (4 Gig x 4) component

data sheet.

Parameter Symbol 3200 2933 Units

One bank ACTIVATE-PRECHARGE current IDD0 990 972 mA

One bank ACTIVATE-PRECHARGE, word line boost, IPP current IPP0 54 54 mA

One bank ACTIVATE-READ-PRECHARGE current IDD1 1188 1170 mA

Precharge standby current IDD2N 810 792 mA

Precharge standby ODT current IDD2NT 918 900 mA

Precharge power-down current IDD2P 684 684 mA

Precharge quite standby current IDD2Q 756 756 mA

Active standby current IDD3N 1080 1062 mA

Active standby IPP current IPP3N 36 36 mA

Active power-down current IDD3P 864 846 mA

Burst read current IDD4R 2286 2142 mA

Burst write current IDD4W 1728 1656 mA

Burst refresh current (1x REF) IDD5R 1224 1224 mA

Burst refresh IPP current (1x REF) IPP5R 72 72 mA

Self refresh current: Normal temperature range (0°C to 85°C) IDD6N 954 954 mA

Self refresh current: Extended temperature range (0°C to 95°C) IDD6E 1620 1620 mA

Self refresh current: Reduced temperature range (0°C to 45°C) IDD6R 360 360 mA

Auto self refresh current (25°C) IDD6A 198 198 mA

Auto self refresh current (45°C) IDD6A 360 360 mA

Auto self refresh current (75°C) IDD6A 918 918 mA

Auto self refresh current (95°C) IDD6A 1620 1620 mA

Auto self refresh IPP current IPP6X 108 108 mA

Bank interleave read current IDD7 4860 4590 mA

Bank interleave read IPP current IPP7 198 198 mA

Maximum power-down current IDD8 648 648 mA

asf18c4gx72pz.ditamap Page 7

Micron w E WWWWW WWWWW NWWWW WWWWW N N%%%% %%%%W V“ WWWWW WWWWW WWWWW WWNWW WWWWW ”WWW” WWWWW $XWNW$X WWWWW Wwwww WWWWW

CCM005-341111752-10523 Micron Technology, Inc. reserves the right to change products or specifications without notice.

32GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

Functional Block Diagram

Figure 2: Functional Block Diagram

Note: 1. The ZQ ball on each DDR4 component is connected to an external 240Ω ±1% resistor that is tied to ground. It is

used for the calibration of the component’s ODT and output driver.

asf18c4gx72pz.ditamap Page 8

DQ0

DQ1

DQ2

DQ3

Vss

DQ4

DQ5

DQ6

DQ7

Vss

U20

DQS0_t

DQS0_c

DQS9_t

DQS9_c

DQ8

DQ9

DQ10

DQ11

Vss

DQ12

DQ13

DQ14

DQ15

Vss

U19

DQS1_t

DQS1_c

DQS10_t

DQS10_c

DQ16

DQ17

DQ18

DQ19

Vss

DQ20

DQ21

DQ22

DQ23

Vss

U18

DQS2_t

DQS2_c

DQS11_t

DQS11_c

DQ24

DQ25

DQ26

DQ27

Vss

DQ28

DQ29

DQ30

DQ31

Vss

U17

DQS3_t

DQS3_c

DQS12_t

DQS12_c

CB0

CB1

CB2

CB3

Vss

CB4

CB5

CB6

CB7

Vss

U16

DQS8_t

DQS8_c

DQS17_t

DQS17_c

DQ32

DQ33

DQ34

DQ35

Vss

DQ36

DQ37

DQ38

DQ39

Vss

U15

DQS4_t

DQS4_c

DQS13_t

DQS13_c

DQ40

DQ41

DQ42

DQ43

Vss

DQ44

DQ45

DQ46

DQ47

Vss

U14

DQS5_t

DQS5_c

DQS14_t

DQS14_c

DQ48

DQ49

DQ50

DQ51

Vss

U10

DQ52

DQ53

DQ54

DQ55

Vss

U13

DQS6_t

DQS6_c

DQS15_t

DQS15_c

DQ56

DQ57

DQ58

DQ59

Vss

U11

DQ60

DQ61

DQ62

DQ63

Vss

U12

DQS7_t

DQS7_c

DQS16_t

DQS16_c

A/B-CS0_n

A/B-CS0_n, A/B-BA[1:0]A/B-BG[1:0],

A/B-ACT_n, A/B-A[17, 13:0], A/B-RAS_n/A16,

A/B-CAS_n/A15, A/B-WE_n/A14,

A/B-CKE0, A/B-ODT0

CK[1:0]_t

CK[1:0]_c

Command, control, address, and clock line terminations:

DDR4

SDRAM

VTT

DDR4

SDRAM

VDD

SPD EEPROM/

Temperature

sensor

A1 A2

SA0 SA1

SDA

SCL

EVT

EVENT_n

CS_n DQS_t DQS_c

SA2

REFCA

DDR4 SDRAM, Register

Control, command and

address termination

DDSPD

SPD EEPROM/Temp Sensor,

DDR4 SDRAM, Register

DDR4 SDRAM

CS0_n

BA[1:0]

BG[1:0]

ACT_n

A[17, 13:0]

RAS_n/A16

CAS_n/A15

WE_n/A14

CKE0

ODT0

PAR_IN

ALERT_CONN_N

A/B-CS0_n: Rank 0

A/B-BA[1:0]: DDR4 SDRAM

A/B-BG[1:0]: DDR4 SDRAM

A/B-ACT_n: DDR4 SDRAM

A/B-A[17,13:0]: DDR4 SDRAM

A/B-RAS_n/A16: DDR4 SDRAM

A/B-CAS_n/A15: DDR4 SDRAM

A/B-WE_n/A14: DDR4 SDRAM

A/B-CKE0: Rank 0

A/B-ODT0: Rank 0

A/B-PAR: DDR4 SDRAM

ALERT_DRAM: DDR4 SDRAM

RESET_N

CK[1:0]_c

DDR4 SDRAM

QRST_N: DDR4 SDRAM

CK[1:0]_t

VSS

SA0

SA1

SA2

SCL

SDA

CK0_t

CK0_c

CK1_t

CK1_c

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CCM005-341111752-10523 Micron Technology, Inc. reserves the right to change products or specifications without notice.

32GB (x72, ECC, SR) 288-Pin DDR4 RDIMM

Module Dimensions

Figure 3: 288-Pin DDR4 RDIMM, RC-C3

Notes: 1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted.

2. The dimensional diagram is for reference only.

3. Tolerance on all dimensions ±0.15mm unless otherwise specified.

31.40 (1.236)

31.10 (1.224)

0.75 (0.03) R

(8X)

Front view

133.48 (5.255)

133.22 (5.244)

Back view

1.5 (0.059)

1.3 (0.051)

3.9 (0.153)

MAX

3.0 (0.118) (4X) TYP

9.5 (0.374)

TYP

Pin 1

5.95 (0.234) TYP

126.65 (4.99)

TYP

0.85 (0.033)

TYP

0.60 (0.0236)

TYP

0.75 (0.030) R

64.6 (2.54)

TYP

56.10 (2.21)

TYP

Pin 288 Pin 145

2.20 (0.087) TYP

72.25 (2.84)

TYP

0.5 (0.0197) TYP

28.9 (1.14)

TYP

10.2 (0.4)

TYP

25.5 (1.0)

TYP

22.95 (0.9)

TYP

10.2 (0.4)

TYP

22.95 (0.90)

TYP

3.35 (0.132) TYP

(2X)

3.15 (0.124)

TYP

14.6 (0.57)

TYP 8.0 (0.315)

TYP

16.1 (0.63)

TYP

Pin 144

1.25 (0.049) x 45° (2X)

2.25 (0.88) TYP

1.5 (0.059) D

(2X)

1.75 (0.069) TYP

U15

U14

U13

U12

U11

U10

U20

U19

U18

U17

U16

U2 U6

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006

208-368-4000, micron.com/support

Micron and the Micron logo are trademarks of Micron Technology, Inc.

All other trademarks are the property of their respective owners.

This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.

Although considered final, these specifications are subject to change, as further product development and data characterization sometimes

occur.

asf18c4gx72pz.ditamap Page 9

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