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Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.

12/28/2020 2:12:58 PM

Part List

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
CONN SPRING MOD 25POS SMD3800520001CONN SPRING MOD 25POS SMD1 - Immediate$808.38View Details
CONN SPRING MOD 51POS SMD3800520013CONN SPRING MOD 51POS SMD0 - Immediate$757.84View Details
CIN::APSE STACKING HARDWRE 25POS3180299353CIN::APSE STACKING HARDWRE 25POS0 - Immediate$252.64View Details
CIN::APSE STACKING HARDWRE 51POS3180299356CIN::APSE STACKING HARDWRE 51POS0 - Immediate$281.37View Details
CABLE FFC/FPC 25POS 0.64MM 3"4631533093CABLE FFC/FPC 25POS 0.64MM 3"12 - Immediate$154.43View Details
CABLE FFC/FPC 51POS 0.64MM 3"4631533094CABLE FFC/FPC 51POS 0.64MM 3"0 - Immediate$154.43View Details

Related Product Highlight

CIN::APSE Stacking Connector Jumpers Cinch Connectivity’s CIN:APSE stacking connectors are designed for coplanar and angled board-to-board applications.

Related Articles and Blogs

Selecting Space-Grade Connectors for LEO Satellite Applications How space-grade connectors address the challenges of low earth orbit (LEO) satellites, including outgassing, radiation, thermal cycling, shock, and vibration.