In theory, 60% of the heat can be dissipated through the PCB / CCA side of the board, and the remaining 40% through the retainer side. Therefore, for applications with demanding thermal transfer requirements, frame or clamshell CCAs should be used in conjunction with the Wedge Lok. The lower diagram on this slide shows a comparison of the thermal transfer characteristics of a retainer and cold plate versus a conduction cooled assembly with integrated retainers. The left is the retainer based solution, which removes heat from the edge of a PCB directly to the cold plate or chassis. The CCA solution on the right provides uniform heat dissipation from high heat areas on the PCB to the CCA and retainers, which ultimately transfers heat though the cooling plates on either side of the circuit board. For applications requiring shock and vibration or thermal requirements beyond what a Wedge Lok alone can provide, Schroff offers a heat frame solution.