Combining two SIDACtor chips in a single package has some advantages. For instance, the twin chip design gives board designers twice the density of protection. That plays well in today’s telecom market where product density is a key selling feature. Another advantage of the twin chip series is that, because the two SIDACtor chips are cut from the same silicon wafer, they are perfect matched pair. Twin SLIC devices offer the same advantages to the SLIC card designer. Telecom designers appreciate the one package per port simplicity of these designs. The broadband optimized devices have two chips in series inside the device, but the center terminal is not available. This is used as a single device but it has the advantages of half the capacitance of a single device and better capacitance linearity. These devices are often used in VDSL applications where these advantages are valued.