Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Slide 12 Slide 13 Slide 14 Product List
LED-Slide12

Bond-Ply 450 is a highly thermally conductive adhesive tape that can be pre-applied to Bergquist T-Clad boards. This material features a release liner on the backside for easy removal and application to heat sink. T-Clad PA substrate release liners can withstand high temperatures and will maintain adhesion and release characteristics even after exposure to the extreme heat of solder reflow.

PTM Published on: 2011-10-19