zSFP+ Interconnect

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            zSFP+ Interconnect
                    TE Connectivity's zSFP+ pluggable I/O interconnect was designed to upgrade SFP/SFP+ connectors
    

Image of TE Connectivity's zSFP+ Interconnect TE Connectivity's zSFP+ pluggable I/O interconnect was designed to quickly and easily upgrade SFP/SFP+ connectors from current 10-16 Gbps speeds to future 28 Gbps speeds. The product is backwards-compatible to SFP+ products in footprint, mating interface, and cage dimensions to allow for easy drop-in replacement within current communication systems.

For newer equipment designs, the zSFP+ interconnect can support either 10 Gbps Ethernet or 16 Fibre Channel Gbps data rates, while accommodating a long-term upgrade path for 28 or potentially 40 Gbps performance. This equates to long-term cost savings as the product eliminates the need to fully redesign or reinstall communication equipment for higher performance.

The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32 G (28.05 Gbps line rate). The entire product family is offered as a dual-source option with Molex Incorporated.

Features

Data Rates

28 Gbps up to potentially 40 Gbps

Surface-mount connector design
Press-fit cages for one-step, easy PCB placement
Coupled, narrow-edged, blanked-, and formed-contact geometry and insert molding for superior signal integrity, mechanical, and electrical performance
Backwards compatibility: Shares same PCB footprint, mating interface, and cage dimensions with the SFP+ connector
EMI containment offered in either elastomeric gasket or spring finger options
Single-port high cages (1 x N) for design flexibility/accommodates belly-to-belly applications to increase density while saving PCB space
Offers stacked cages in 2 x 1, 2 x 2, 2 x 4, 2 x 6, 2 x 8, 2 x 10, and 2 x 12 port configurations
Heat sinks, LEDs, and plating choices offered for various design specifications

Mechanical

Mating force: 25 N
Unmating force: 11.5 N
Durability (min.): 250 cycles

Electrical

Voltage (max.): 120 V max
Current (max.): 0.5 A
Dielectric withstanding voltage: 300 VAC between contacts

Physical

High-temperature thermoplastic housing (glass filled, UL 94V-0 black)
High-performance copper alloy contacts
Nickel underplating, tin plating on solder tail area, and gold plating on mating area
Operating temperature: -40°C to 85°C

Applications
Telecommunications Cellular infrastructure Access routers and switches Servers Switches Data center Servers Storage	Medical Medical diagnostic equipment Networking Network interface Switches Routers Test and measurement equipment

zSFP Interconnect

Manufacturer Part Number	Description	Number of Positions	Available Quantity
2170088-1	CONN ZSFP+ RCPT 20POS SLD RA SMD	20	4229 - Immediate	View Details
2170088-2	CONN ZSFP+ RCPT 20POS SLD RA SMD	20	6122 - Immediate	View Details
2198318-2	CONN ZSFP+ RCP W/CAGE 2X1 40P RA	40 (20 x 2)	180 - Immediate	View Details
2198318-6	CONN ZSFP+ RCP W/CAGE 2X1 40P RA	40 (20 x 2)	335 - Immediate	View Details
2180324-2	CONN ZSFP+ RCPT CAGE 2X4 160P RA	160 (20 x 8)	5 - Immediate	View Details
2180324-6	CONN ZSFP+ RCPT CAGE 2X4 160P RA	160 (20 x 8)	46 - Immediate	View Details
2198339-2	CONN ZSFP+ RCPT CAGE 2X6 240P RA	240 (20 x 12)	32 - Immediate	View Details
2198339-6	CONN ZSFP+ RCPT CAGE 2X6 240P RA	240 (20 x 12)	29 - Immediate	View Details

Published: 2013-12-06

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