High-Speed Pluggable I/O Solutions

Pluggable I/O interfaces offer significant advantages as a high-speed I/O interconnect. Along with a standard equipment I/O interface and the flexibility of pluggable modules, TE Connectivity’s (TE) high-speed pluggable I/O products include options for fiber and copper links, as well as various data rates and protocols.

TE has always been a leader in the development of pluggable I/O standards. TE continues to be engaged in new pluggable interface standards to support the rapidly changing market needs for higher bandwidth, and remains an industry leader with the technical expertise required to deliver superior designs for signal integrity and EMI at higher data rates.

Micro SFP+ Connector and Cable Assembly

TE micro SFP+ connector and cable assembly empower you to dream big when designing your communication system through a footprint that’s up to 50% smaller than current SFP+ interconnects. The micro SFP+ interconnects allow you to increase faceplate density while freeing up additional PCB space due to the board connector’s shortened length. The products’ designs have also been enhanced to improve signal routing, minimize EMI and optimize automated manufacturing processes.

Applications:

  • Telecommunications: cellular infrastructure, hubs servers and switches
  • Data communication: servers and storage equipment
  • Medical diagnostic equipment
  • Networking: network interface, storage, power supplies and test and measurement equipment

zSFP+ Interconnect

TE's zQSFP+ interconnects offer an increased data rate of 28 Gbps in an industry standard, scalable design that allows for backwards compatibility with QSFP/QSFP+ cables and transceivers, providing a simple upgrade path from 10 Gbps to 28 Gbps. The complete portfolio of interconnects deliver a large range of simple and customizable design options to meet most customer requirements.

Key Features:

Increased Data Rates

  • 2.5 times more throughput than traditional QSFP solutions
  • Data transfer rates of 28 Gbps
  • Supports 100 Gbps Ethernet (28 Gbps x 4), and 100 Gbps InfiniBand (IB) Enhanced Data Rate (EDR) requirements

Industry Standard and Customizable Design

  • Industry standard interface
  • Backwards compatible with QSFP/QSFP+ cables and transceivers
  • Higher loss budget for optics and copper cables at 10 Gbps

Comprehensive Portfolio and Inventory

  • Dual sourced product available through Molex, LLC.
  • Features behind and through bezel cages with various lightpipe and heat sink options
  • Well-stocked distribution channel

Improved EMI Performance

  • Increased data rates make EMI protection more challenging
  • Provide excellent EMI protection through 28 Gbps

Applications:

  • Network Interface
  • Switches
  • Servers
  • Routers
  • Wireless Base Stations
  • Test and Measurement Equipment

z-Quad Small Form-factor Pluggable Plus (zQSFP+) Interconnect System

TE’s zQSFP+ (z-Quad Small Form-factor Pluggable Plus) connector and cage assembly has been designed for applications in the telecommunications, data center and networking markets that require a high-speed, high-density connector. The interconnect offers four channels of high-speed differential signals with data rates ranging from 25 Gbps up to potentially 40 Gbps, and will support 100 Gbps (4 x 25 Gbps) Ethernet and 100 Gbps 4X InfiniBand Enhanced Data Rate (EDR) requirements.

Key Features:

  • Backwards-compatible with QSFP optical modules and cable assemblies
  • Enhanced EMI cage helps provide excellent thermal performance/EMI protection
  • 1 x 1 through 1 x 6 ganged cages
  • Stacked 2 x 1 through 2x3 cages with thermally enhancements available
  • Coupled, narrow-edged, blanked- and formed-contact geometry/insert molding
  • Staggered press-fit pins for belly-to-belly applications
  • High-temperature, thermoplastic housing

Applications:

  • Telecommunications: Servers, switches, access routers and switches, and cellular infrastructure
  • Data Center: Servers and storage
  • Medical: Diagnostic equipment
  • Networking: Network interface, routers, switches and storage
  • Test and measurement equipment

QSFP (Quad Small Form-factor Pluggable)

QSFP (or quad SFP) connectors provide four channels of data in one pluggable interface. Each channel is capable of transferring data up to 14 Gbps, supporting a total of 56 Gbps. These interconnects have 3x the density of SFP+ interconnects. The QSFP product family includes cages in single and ganged configurations with various heat sink and lightpipe options. The connector is a 38-position, high-speed SMT connector. EMI plugs are offered for empty ports.

Key Features:

  • 4-channels in one interface, providing 3 to 4x density of, SFP+ and XFP
  • Meets QSFP+ 10 Gbps Ethernet and 14 Gbps InfiniBand requirements (total 40- and 56-Gbps interface)
  • Uses 38-position SMT connector
  • Cages offered in single port and ganged configurations
  • 2x1 and 2x2 stacked assemblies also available
  • Cages accommodate belly-to-belly mounting
  • Heat sinks and lightpipes available

Applications:

  • Storage
  • Servers
  • Networking
  • Switches, routers and hubs
  • Network Interface Cards (NICs)
  • Telecommunication equipment

Small Form-factor Pluggable (SFP)

TE’s family of SFP+ interconnects is designed to transfer data at speeds of up to 16 Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. The SFP+ interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance.

Key Features:

  • Supports applications up to 16 Gb/s
  • Offers cages in single-port, ganaged and stacked configurations. Belly-to-belly mounting cages also offered
  • Uses enhanced 20-position connector that is backward-compatible with SFP connectors
  • Features elastomeric gaskets and springs for EMI containment
  • Offers heat sink and light pipe options

Applications:

  • Storage, servers, routers, switches and hubs
  • Network Interface Cards (NICs)
  • Other telecommunications equipment

SFP+ (Small Form-factor Pluggable)

The TE SFP+ product family extends the use of the Small Form-factor Pluggable (SFP) interconnect up to 10 Gbps. This system meets the performance requirements of SFF (Small Form-factor) specification SFF-8431 and supports 8 G Fiber Channel, 10G Ethernet, InfiniBand™ standard and Fibre Channel over Ethernet (FCoE) applications. The SFP+ product family includes cable assemblies, cages and connectors.

The TE SFP+ direct-attach copper cable assemblies provide a cost-effective solution over fiber optics in short reach applications. The design allows for serial data transmission up to 10 Gbps in each direction. The mechanical design of the cable braid crimp and EMI skirt suppress EMI radiation. Low power consumption helps make the SFP+ copper cable assembly an economical solution for within rack or rack-to-rack applications. Both passive and active copper cable assemblies are available.

The passive cable assembly design has no signal amplification in the cable assembly. Electronic Dispersion Compensation (EDC) is typically used on host board designs when passive SFP+ copper assemblies are utilized. EDC allows for an extended length of passive cable assemblies. The industry-standard EEPROM signature enables the host system to differentiate between a passive copper cable and a fiber optic module.

The active cable assembly design has signal amplification and equalization in the assembly. Active copper assemblies are typically used in host systems that do not employ EDC. Active SFP+ cable assemblies also incorporate Rx LOS and Tx Disable features. As with passive cables, the industry-standard EEPROM signature enables the host system to differentiate between an active copper cable and a fiber optic module.

Key Features:

  • MSA SFF-8431
  • Supports serial data rates up to 10 Gbps
  • Low-cost alternative to fiber optic assemblies
  • Low power consumption
  • Enhanced EMI suppression
  • 24 AWG through 30 AWG cable available
  • Pull-to-release retractable pin latch design

Applications:

  • Switches
  • Networking: servers, routers and hubs
  • Enterprise storage
  • Telecommunications equipment
  • Network Interface Cards (NIC's)

EEPROM is a trademark of NEC Electronics Corporation.
InfiniBand™ is a trademark of INFINIBAND Trade Association.

XFP 10 Gigabit Serial Pluggable Products

XFP is a cage/connector/module system that features gasketing for excellent EMI containment, a riding heatsink for thermal dissipation, an intuitive latching system, and a 30 position SMT connector based on the SFP connector design. TE also offers copper cable assemblies that plug directly into an XFP port for lower cost short-reach applications. This technology converts serial electrical signals to external serial optical or electrical signals and is intended to be flexible enough to support OC192/STM-64, 10x Fibre Channel, G.709, and 10 G Ethernet.

Key Features:

  • 10 Gb/s serial link
  • EMI containment features
  • Module to XFP Cage
  • XFP Cage to Chassis
  • Uses 30 pin surface mount connector
  • Patented riding heat sink for thermal management
  • Press-fit cage termination
  • Designed to support belly-to-belly applications

Applications:

  • Ethernet
  • Fibre channel

CFP Compliant Ethernet Connectors & Components

This interconnect system supports 40 Gb/s and 100 Gb/s, as required by the IEEE 802.3ba specification as well as other developing telecom protocols. The CFP connector features multiple channels, each supporting 10 Gb/s with electrical performance surpassing that of existing 10 Gb/s interfaces.

The connector interface is a two piece solution consisting of a plug connector which is integrated by optical transceiver suppliers, and a host board receptacle connector. The additional host board components include the receptacle cover, guide rails, external bracket assembly, backer plate and riding heat sink to provide a complete solution. The integrated system provides the mechanical, EMI and thermal performance necessary to support the demanding requirements of the CFP MSA Optical Transceivers and OEM host line cards.

Key Features:

  • 148-position interconnect
  • Supports 10 Gb/s per channel
  • Designed for belly-to-belly port positioning
  • Accepts all CFP MSA-compliant optical transceivers
  • Excellent EMI shielding
  • RoHS compliant

Applications:

  • Switches
  • Routers
  • Optical Transport equipment
  • Long Haul, Metro and MultiService Provisioning Platform

CXP Connector and Cage Assemblies

TE's CXP connector and cage assembly offers twelve channels of 12.5 Gbps data rates for 150 Gbps of total bandwidth in a one-piece press-fit assembly. TE's CXP system complies with InfiniBand CXP 12x QDR and IEEE 100 Gbps Ethernet standards and enables pluggable copper or optical cable options. The system has been engineered for applications in high-speed data environments with EMI gasketing at bezel opening and EMI springs for plug-to receptacle containment. It provides one-step placement to the host board and comes with multiple heatsink, lightpipe and EMI/dust plug options. Enhanced EF, dual sourced footprint offers reduced cross-talk and improved electrical performance.

TE also offers a complement of fiber optic cable assemblies with CXP fiber paths to interconnect CXP transceivers to CXP, QSFP+ and SFP+ transceivers. All are available with OM2 and OM3 fiber as a standard offering, with OM4 being available upon request.

Key Features:

  • Standard CXP interface complies with InfiniBand CXP 12x QDR and IEEE 100 Gbps Ethernet
  • Provides 12 channels of 12.5 Gbps data rates for 150 Gbps of total bandwidth in a one-piece press-fit assembly
  • Dual-sourced, Enhanced Footprint (EF) offers reduced cross-talk
  • Pre-assembled (one-piece) connector and cage assembly offers one-step placement to the board
  • EMI gasketing at bezel opening and EMI springs for plug-to-receptacle containment
  • CXP cages accommodate belly-to-belly mounting (can be applied to both sides of the board)
  • Offering includes multiple heatsink, lightpipe and EMI/dust plug options to fit customer applications

Applications:

  • Controller Cards and servers
  • Network switches
  • Routers
  • Storage devices
  • Direct Attached Storage (DAS)
  • Storage Attached Networks (SAN)
  • Network Attached Storage (NAS)

TE Connectivity and TE connectivity (logo) are trademarks.

zSFP+ and zQSFP+ are part of the ZXP® family of connectors and use ZXP technology. ZXP is a trademark of Molex, LLC.

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