µPOL DC/DC Converter Modules with Full Telemetry

TDK FS160* series of microPOL (μPOL) power modules offer full telemetry, increased performance, and extraordinary power density in a small size of 3.3 mm x 3.3 mm x 1.35 mm (w x d x h). Because of their size and extraordinary power density, every module in this series can be easily integrated into designs anchored by ASICs, SoCs, and all the most popular FPGAs. Full telemetry (voltage, current, and temperature) is accessible via an I²C interface. The modules operate across a broad junction temperature range, from -40°C to +125°C.

There are several versions of each of the 3 A parts (the FS1603 series), 4 A parts (the FS1604 series), and 6 A parts (the FS1606 series), and the FS line also includes models at 12 A (the FS1412). The selection of DC/DC converter modules that range from 3 A to 200 A covers a broad range of needs and applications, including big data, machine learning, artificial intelligence (AI), 5G cells, the Internet of Things (IoT), and enterprise computing.

The FS160* series modules integrate a high-performance controller, drivers, MOSFETs, and a logic core in carefully engineered packages using a version of semiconductor embedded in substrate (SESUB) from TDK. SESUB eliminates wire bonds and enhances thermal performance. TDK also integrates the module’s IC inductor and passives into a chip-embedded package to minimize parasitic inductance. This lowers interconnect and enhances the module’s efficiency, minimizing resistance and inductance leading to fast response and accurate regulation with dynamic load currents. Boot and V_CC capacitors are also incorporated into the module.

These and other design optimizations make it possible for FS160* series converters to deliver an extraordinary 1 W per cubic millimeter in modules that are roughly half the size of other products in the same class. The FS160* series modules are so effective that they require no airflow whatsoever for up to 15 W to 30 W in up to +100°C ambient temperature. The end result of using TDK modules is a small solution size that requires less PCB board space and fewer board layers as well as fewer external components, resulting in lower system costs.

The modular approach makes designing with the FS160* a simple matter for either analog or digital design configuration for 0.6 V to 5.0 V outputs. TDK has created multiple design tools for designers to use, including tools specific to FPGAs from each of the major FPGA suppliers. Evaluation boards are available, one each for modules at 3 A, 4 A, and 6 A (respectively the FS1603 series, FS1604 series, and FS1606 series). Additional design tools for FS160* series includes SPICE simulator designs on QSPICE™. Fast starter designs for schematic and PCB layout are now available at Ultra Librarian, https://www.ultralibrarian.com/partners/tdk.