Webinar – Stacking the Deck for Vertical Power Delivery

Increasingly efficient and effective electronic systems use unprecedented power density techniques and innovative PCB designs. Thermal dissipation, board space, noise reduction, and signal integrity management are key concerns to deliver reliable performance. Vertical power is emerging as a smart solution — placing point-of-load (POL) power modules on the back side of the PCB to save space and separate high-speed signals from PDN (Power Delivery Network) traces.

Gain insights into the design methodologies from Bill Pelletier, Field Applications Engineer for TDK Corporation as he reveals the support and architecture of Silicon Embedded Substrate technologies (SESUB) that enable innovative stacking and how TDK’s high-current µPOL regulators exemplify these concepts and accelerate development. Discover the role advanced magnetics play in enabling compact, high-performance power delivery and the library of simulation models, schematics, and layout files for effective µPOL regulator implementation.

The one-hour online webinar takes place on Tuesday, June 17, 2025, at 10:00 AM CDT. Even if you are unable to attend the live session, please be sure to register so we can send you a link to the recording when it is complete.

Register here:https://event.on24.com/wcc/r/4938405/F1CB628AE4D5748BEEF96A833E6688AF?partnerref=blog