STEVAL-STWIN Sensortile Wireless Industrial Node Development Kit

The STMicroelectronics STEVAL-STWIN SensorTile wireless industrial node development kit features a core system board with a range of embedded industrial-grade sensors and an ultra-low-power microcontroller for vibration analysis of 9-DoF motion sensing data across a wide range of vibration frequencies, including very high-frequency audio and ultrasound spectra, and high precision local temperature and environmental monitoring.

The development kit is complemented with a rich set of software packages, optimized firmware libraries, and a cloud dashboard application, all provided to help speed up design cycles for end-to-end solutions. The STEVAL-STWINBX1 version supports a broad range of connectivity options, including the built-in RS485 transceiver, Bluetooth® Low Energy (BLE), Wi-Fi, and NFC. The STEVAL-STWINKT1B version supports BLE wireless connectivity through an onboard module and Wi-Fi connectivity through a special plugin expansion board (STEVAL-STWINWFV1). The STEVAL-STWINKT1B also includes an STMod+ connector for compatible, low-cost, small form factor daughter boards associated with the STM32 family, such as the LTE Cell pack.

Apart from the core system board, the kit comes with a 480 mAh Li-Po battery, an STLINK debugger, and a plastic box.

Features for STEVAL-STWINKT1B

• Vibration monitoring and ultrasound detection
• Core system board with processing, sensing, connectivity, and expansion capabilities
• Ultra-low-power Arm® Cortex®-M4 MCU (STM32L4R9)
• microSD™ card slot for data logging
• Wireless BLE4.2 (onboard), Wi-Fi (with STEVAL-STWINWFV1 expansion), wired RS485, and USB OTG connectivity
• Option to implement authentication and brand protection with STSAFE-A110
• 3-axis digital vibration sensor (IIS3DWB)
• 3D accelerometer + 3D gyro IMU (ISM330DHCX) with machine learning core
• MEMS motion sensor (IIS2DH)
• 3-axis magnetometer (IIS2MDC)
• Digital pressure sensor (LPS22HH)
• Humidity and temperature sensor (HTS221)
• Digital temperature sensor (STTS751)
• Digital MEMS microphone (IMP34DT05)
• Analog MEMS microphone up to 80 kHz (IMP23ABSU)
• Modular architecture with onboard connectors (e.g., STMod+ connector) for additional connectivity options, sensors, and other function boards
• Li-Po battery 480 mAh
• STLINK-V3MINI debugger with programming cable

Features For STEVAL-STWINBX1

• Multi-sensing wireless platform for vibration monitoring and ultrasound detection
• Built around STWIN.box core system board with processing, sensing, connectivity, and expansion capabilities
• Ultra-low power Arm Cortex-M33 with FPU and TrustZone at 160 MHz, 2048 kBytes Flash memory (STM32U585AI)
• microSD card slot for standalone data logging applications
• Onboard BLE v5.0 wireless technology (BlueNRG-M2), Wi-Fi (EMW3080) and NFC (ST25DV04K)
• Option to implement authentication and brand protection secure solution with STSAFE-A110
• Wide range of industrial IoT sensors:
  • Ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
  • 3D accelerometer + 3D gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
  • High-performance ultra-low-power 3-axis accelerometer for industrial applications (IIS2DLPC)
  • Ultra-low power 3-axis magnetometer (IIS2MDC)
  • High-accuracy, high-resolution, low-power, 2-axis digital inclinometer with embedded machine learning core (IIS2ICLX)
  • Dual full-scale, 1.26 bar and 4 bar, absolute digital output barometer in full-mold package (ILPS22QS)
  • Low-voltage, ultra-low-power, 0.5°C accuracy I²C/SMBus 3.0 temperature sensor (STTS22H)
  • Industrial grade digital MEMS microphone (IMP34DT05)
  • Analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)
• Expandable via a 34-pin FPC connector