The OSD335x-SM family of SiP products from Octavo Systems leverages Texas Instruments’ Sitara™ AM335x processors to allow easy and cost-effective system implementations based on these powerful chips. These SiPs integrate TI’s AM335x processors, TPS65217C PMIC, and TL5209 LDO with up to 1 GB of DDR3 memory, 4 KB EEPROM for non-volatile configuration storage, and resistors, capacitors, and inductors into a design-in-ready package of just 21 mm x 21 mm.
This level of integration allows developers using the OSD335x-SM SiP family to concentrate on the essential system features and not spend time on the PMIC power distribution or the rather involved design of the high-speed processor to DDR3 interface. This SiP can greatly reduce time-to-market for AM335x-based designs by reducing overall size and complexity along with the required supply chain.
OSD335x-SM Block Diagram
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- TI AM335x features:
- Arm® Cortex®-A8 up to 1 GHz
- 8-channel 12-bit SAR ADC
- Ethernet 10/100/1000 x 2
- USB 2.0 HS OTG + PHY x2
- MMC, SD, and SDIO x3
- LCD controller
- SGX 3D graphics engine
- PRU subsystem
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- TI AM335x, TPS65217C, TL5209, DDR3, EEPROM and passive components integrated into a single package
- Access to all AM335x peripherals: CAN, SPI, UART, I2C, GPIO, etc.
- Up to 1 GB DDR3
- PWR In: AC adapter, USB, or single cell (1S) Li-Ion / Li-Po battery
- PWR Out: 1.8 V, 3.3 V, and SYS
- Selectable AM335x I/O voltage: 1.8 V or 3.3 V
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| Benefits |
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- Integrates over 100 components into one package
- Compatible with AM335x development tools and software
- Wide BGA ball pitch allows for low-cost assembly
- Significantly reduces design time
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- Decreases layout complexity
- 60% reduction in board space vs discrete implementation
- Increased reliability through reduced number of components
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The OSD335x-SM family of SiP products from Octavo Systems leverages Texas Instruments’ Sitara™ AM335x processors to allow easy and cost-effective system implementations based on these powerful chips. These SiPs integrate TI’s AM335x processors, TPS65217C PMIC, and TL5209 LDO with up to 1 GB of DDR3 memory, 4 KB EEPROM for non-volatile configuration storage, and resistors, capacitors, and inductors into a design-in-ready package of just 21 mm x 21 mm.
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