Octavo Systems

OSD335x System-in-Package (SiP) Family

Octavo Systems integrates the TI AM335x, TPS65217C, TL5209, and DDR3 in a 27 mm x 27 mm package

Image of Octavo Systems' OSD335x System-in-Package (SiP) FamilyOctavo Systems' OSD335x family of SiP products are building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD335x integrates the AM335x along with the TI TPS65217C PMIC and TI TL5209 LDO, up to 1 GB of DDR3 memory, and over 140 resistors, capacitors, and inductors all into a single design-in-ready package.

With this level of integration the OSD335x family of SIPs allows designers to focus on the key aspects of their system without spending time on the complicated high-speed design of the processor/DDR3 interface. It also reduces the overall size and complexity of the design. The OSD335x can significantly decrease the time to market for AM335x-based products.

OSD335x Block Diagram

Features
  • TI AM335x features:
    • ARM® Cortex®-A8 up to 1GHz
    • 8-channel 16-bit SAR AD
    • Ethernet 10/100/1000 x 2
    • USB 2.0 HS OTG + PHY x2
    • MMC, SD, and SDIO x2
    • LCD controller and 3D graphics engine
  • TI AM335x, TPS65217C, TL5209, DDR3, and over 140 passive components integrated into a single package
  • Access to all AM335x GPIOs and peripherals
  • Up to 1 GB DDR3
  • PWR in from 5 VDC, USB, or Li-Ion battery
  • PWR out: 1.8 V, 3.3 V, and Sys
  • 400 ball 1.27 mm pitch BGA (20 x 20)
Benefits
  • Integrates over 140 components into one
  • Compatible with AM335x development tools and software
  • Wide BGA ball pitch allows for low-cost assembly.
  • Significantly reduces design time
  • Decreases layout complexity
  • Saves board space
  • Increased reliability through reduced number of components
  • Power savings and increased performance
    • Shorter signal trace lengths
    • Reduced parasitics
  • 27 mm x 27 mm package size
  • Temperature range: 0°C to +90°C or -40°C to +85°C

OSD335x System-in-Package (SiP)

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
IC MODULE CORTEX-A8 1GHZ 512MBOSD3358-512M-BASIC MODULE CORTEX-A8 1GHZ 512MB0 - ImmediateSee Page for PricingView Details
IC MODULE CORTEX-A8 1GHZ 512MBOSD3358-512M-INDIC MODULE CORTEX-A8 1GHZ 512MB0 - ImmediateSee Page for PricingView Details
Published: 2016-05-18

Related Videos

PocketBeagle USB-Key-Fob Computer | Maker Minute
PocketBeagle USB-Key-Fob Computer | Maker Minute

Publish Date: 2018-01-11

Octavo Systems OSD335 System-in-Package – Another Geek Moment
Octavo Systems OSD335 System-in-Package – Another Geek Moment

Publish Date: 2017-08-07

Octavo Systems and Nordic Semiconductor New Product Discoveries with Randall Restle Episode 4
Octavo Systems and Nordic Semiconductor New Product Discoveries with Randall Restle Episode 4

Publish Date: 2017-06-21

Related Product Highlight

OSD335x-SM System-in-Package (SiP) Family Octavo Systems' OSD335x-SM is the perfect solution for the designer that is looking for the most flexible Arm®-based solution in the smallest footprint.

Related Articles and Blogs

Microcontroller Systems for Sensor Control and Interface This article discusses the use of application-specific development boards to simplify design tasks and help finalize designs in a timely manner.
Architecting Options for USB into Your Embedded Systems Designs While USB came from the PC world, it is not just a PC phenomenon. Cell phones, cameras, recorders, players, display devices, tuners, and more all use USB connectivity, either as a peripheral, or even as a host. Even picture frames have USB ports.

Related Product Training Modules

OSD335x C-SiP System-in-Package Family This PTM will introduce the OSD335x C-SiP™, A Complete, System-in-Package including technical details, example applications, and benefits to designers.